MJD2955-1G ON Semiconductor, MJD2955-1G Datasheet

TRANS POWER PNP 10A 60V DPAK-3

MJD2955-1G

Manufacturer Part Number
MJD2955-1G
Description
TRANS POWER PNP 10A 60V DPAK-3
Manufacturer
ON Semiconductor
Datasheet

Specifications of MJD2955-1G

Transistor Type
PNP
Current - Collector (ic) (max)
10A
Voltage - Collector Emitter Breakdown (max)
60V
Vce Saturation (max) @ Ib, Ic
8V @ 3.3A, 10A
Current - Collector Cutoff (max)
50µA
Dc Current Gain (hfe) (min) @ Ic, Vce
20 @ 4A, 4V
Power - Max
1.75W
Frequency - Transition
2MHz
Mounting Type
Through Hole
Package / Case
IPak, TO-251, DPak, VPak (3 straight leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MJD2955-1G
Manufacturer:
ON
Quantity:
12 500
MJD2955 (PNP)
MJD3055 (NPN)
Complementary Power
Transistors
DPAK For Surface Mount Applications
applications.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†Safe Area Curves are indicated by Figure 1. Both limits are applicable and must
1. These ratings are applicable when surface mounted on the minimum pad
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 10
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Base Current
Total Power Dissipation @ T
Derate above 25°C
Total Power Dissipation (Note1)
Operating and Storage Junction
Temperature Range
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
(Note1)
be observed.
Designed for general purpose amplifier and low speed switching
(No Suffix)
Lead Formed for Surface Mount Applications in Plastic Sleeves
Straight Lead Version in Plastic Sleeves (“−1” Suffix)
Electrically Similar to MJE2955 and MJE3055
DC Current Gain Specified to 10 Amperes
High Current Gain−Bandwidth Product − f
Epoxy Meets UL 94 V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B u 8000 V
These are Pb−Free Packages
sizes recommended.
@ T
Derate above 25°C
Characteristic
A
= 25°C
Rating
Machine Model, C u 400 V
C
= 25°C
Symbol
Symbol
T
V
R
R
J
P
V
V
P
CEO
, T
I
I
qJC
qJA
CB
EB
D
C
B
D
T
{
stg
= 2.0 MHz (Min) @ I
= 500 mAdc
−55 to +150
0.014
Max
0.16
1.75
Max
6.25
71.4
60
70
10
20
5
6
1
W/°C
W/°C
°C/W
°C/W
Unit
Unit
Vdc
Vdc
Vdc
Adc
Adc
°C
W
W
C
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1 2
1
POWER TRANSISTORS
2
60 VOLTS, 20 WATTS
3
3
ORDERING INFORMATION
A
Y
WW
Jxx55 = Device Code
G
http://onsemi.com
4
10 AMPERES
4
CASE 369C
CASE 369D
STYLE 1
STYLE 1
DPAK−3
SILICON
= Assembly Location
= Year
= Work Week
= Pb−Free Package
DPAK
x = 29 or 30
Publication Order Number:
DIAGRAMS
MARKING
AYWW
xx55G
AYWW
xx55G
J
MJD2955/D
J

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MJD2955-1G Summary of contents

Page 1

... MJD2955 (PNP) MJD3055 (NPN) Complementary Power Transistors DPAK For Surface Mount Applications Designed for general purpose amplifier and low speed switching applications. Features • Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix) • Straight Lead Version in Plastic Sleeves (“−1” Suffix) • ...

Page 2

... Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. ORDERING INFORMATION Device MJD2955G MJD2955−1G MJD2955T4G MJD3055G MJD3055T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (T ...

Page 3

500 300 200 T = 150°C J 100 25°C - 55° 0.01 0.02 0.05 0.1 0.2 0.5 I ...

Page 4

... J 1.6 1 BE(sat 0 0 CE(sat 0.1 0.2 0.3 0 COLLECTOR CURRENT (AMP) C Figure 6. “On” Voltages, MJD2955 1 0 0.5 0.5 0.3 0.2 0.2 0.1 0.1 0.05 0.07 0.02 0.05 0.01 0.03 0.02 SINGLE PULSE 0.01 0.01 0.02 0.03 0.05 0.1 0 150° 100 ms ...

Page 5

... DETAIL 0.005 (0.13 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE GAUGE L2 SEATING C PLANE PLANE DETAIL A ROTATED SOLDERING FOOTPRINT* 6.20 3.0 ...

Page 6

... S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−− STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MJD2955/D ...

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