MJD117G ON Semiconductor, MJD117G Datasheet

MJD117G

Manufacturer Part Number

MJD117G

Description

TRANS DARL PNP 2A 100V DPAK

Manufacturer

ON Semiconductor

Type

Power, Switchr

Datasheets

1.MJD117T4G.pdf (8 pages)

2.MJD117G.pdf (4 pages)

Specifications of MJD117G

Transistor Type

PNP - Darlington

Current - Collector (ic) (max)

Voltage - Collector Emitter Breakdown (max)

100V

Vce Saturation (max) @ Ib, Ic

3V @ 40mA, 4A

Current - Collector Cutoff (max)

20µA

Dc Current Gain (hfe) (min) @ Ic, Vce

1000 @ 2A, 3V

Power - Max

1.75W

Frequency - Transition

25MHz

Mounting Type

Surface Mount

Package / Case

DPak, TO-252 (2 leads+tab), SC-63

Current, Gain

12000

Current, Input

50 mA

Current, Output

2 A

Package Type

DPAK

Polarity

PNP

Power Dissipation

20 W

Primary Type

Resistance, Thermal, Junction To Ambient

71.4

Voltage, Collector To Emitter, Saturation

2 V

Voltage, Input

5 V

Voltage, Output

100 V

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

MJD117G
MJD117GOS

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MJD117G

Manufacturer:

Quantity:

12 500

Current page: 1 of 4
Download datasheet (77Kb)

MJD112 (NPN)

MJD117 (PNP)

Complementary Darlington

Power Transistors

DPAK For Surface Mount Applications

driver stages in applications such as switching regulators, converters,

and power amplifiers.

Features

•

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. These ratings are applicable when surface mounted on the minimum pad

MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Collector−Emitter Voltage

Collector−Base Voltage

Emitter−Base Voltage

Collector Current

Base Current

Total Power Dissipation @ T

Total Power Dissipation (Note1)

Operating and Storage Junction

Thermal Resistance, Junction−to−Case

Thermal Resistance, Junction−to−Ambient

(Note 1)

Designed for general purpose power and switching such as output or

(No Suffix)

Lead Formed for Surface Mount Applications in Plastic Sleeves

Straight Lead Version in Plastic Sleeves (“−1” Suffix)

Electrically Similar to Popular TIP31 and TIP32 Series

Pb−Free Packages are Available

sizes recommended.

Derate above 25°C

@ T

Derate above 25°C

Temperature Range

= 25°C

Characteristic

Rating

− Continuous

− Peak

Preferred Device

= 25°C

Symbol

, T

CEO

qJC

qJA

stg

−65 to +150

0.014

Max

0.16

1.75

Max

6.25

71.4

100

mAdc

W/°C

°C/W

Unit

Vdc

Adc

°C

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

Preferred devices are recommended choices for future use

and best overall value.

1 2

POWER TRANSISTORS

100 VOLTS, 20 WATTS

ORDERING INFORMATION

2 AMPERES

CASE 369C

CASE 369D

SILICON

DPAK−3

DPAK

= Year

= Work Week

= 2 or 7

= Pb−Free Package

DIAGRAMS

MARKING

J11xG

YWW

J11xG

YWW

Related parts for MJD117G

MJD117G Summary of contents

Page 1

MJD112 (NPN) MJD117 (PNP) Preferred Device Complementary Darlington Power Transistors DPAK For Surface Mount Applications Designed for general purpose power and switching such as output or driver stages in applications such as switching regulators, converters, and power amplifiers. Features • ...

Page 2

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 3

... MJD112−001 MJD112−1G MJD112RL MJD112RLG MJD112T4 MJD112T4G MJD117 MJD117G MJD117−001 MJD117−1G MJD117T4 MJD117T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MJD112 (NPN) MJD117 (PNP) ...

Page 4

... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MJD112 (NPN) MJD117 (PNP) PACKAGE DIMENSIONS DPAK CASE 369C ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6.20 3 ...

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