NSBC144WF3T5G ON Semiconductor, NSBC144WF3T5G Datasheet - Page 7

• Manufacturer Part Number: NSBC144WF3T5G
• Description: TRANS DUAL PBRT PNP SOT-1123
• Manufacturer: ON Semiconductor

Specifications of NSBC144WF3T5G

• Transistor Type: NPN - Pre-Biased
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 50V
• Resistor - Base (r1) (ohms): 47K
• Resistor - Emitter Base (r2) (ohms): 22K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 80 @ 5mA, 10V
• Vce Saturation (max) @ Ib, Ic: 250mV @ 300µA, 10mA
• Current - Collector Cutoff (max): 500nA
• Power - Max: 254mW
• Mounting Type: Surface Mount
• Package / Case: SOT-1123
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
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e
c
b1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
1
2
H
D
E
3
*For additional information on our Pb−Free strategy and soldering
−X−
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
b
A
0.08 (0.0032) X Y
E
−Y−
0.25
0.35
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
0.90
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
http://onsemi.com
CASE 524AA−01
SOT−1123
ISSUE B
DIMENSIONS: MILLIMETERS
7
NOTES:
0.30
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
STYLE 1:
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
0.40
H
b1
PIN 1. BASE
A
b
c
D
E
e
L
E
2. EMITTER
3. COLLECTOR
MIN
0.34
0.15
0.10
0.07
0.75
0.55
0.35
0.95
0.05
MILLIMETERS
NOM
0.37
0.22
0.15
0.12
0.80
0.60
1.00
0.10
−−−
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.40
0.28
0.20
0.17
0.85
0.65
0.40
1.05
0.15
0.013
0.006
0.004
0.003
0.030
0.022
0.014
0.037
0.002
MIN
INCHES
NOM
0.015
0.009
0.006
0.005
0.031
0.024
0.039
0.004
−−−−
0.016
0.008
0.007
0.033
0.026
0.016
0.041
0.006
MAX
0.011
NSBC114EF3/D