T1235H-6T STMicroelectronics, T1235H-6T Datasheet - Page 5

• Manufacturer Part Number: T1235H-6T
• Description: TRIAC 12A 600V HI TEMP TO-220AB
• Manufacturer: STMicroelectronics
• Series: Snubberless™r

Specifications of T1235H-6T

• Triac Type: Alternistor - Snubberless
• Mounting Type: Surface Mount
• Configuration: Single
• Current - Hold (ih) (max): 35mA
• Voltage - Off State: 600V
• Current - Gate Trigger (igt) (max): 35mA
• Current - Non Rep. Surge 50, 60hz (itsm): 120A, 126A
• Current - On State (it (rms)) (max): 12A
• Voltage - Gate Trigger (vgt) (max): 1V
• Package / Case: TO-220AB
• Current - On State (it (rms) (max): 12A
• For Use With: 497-9005 - BOARD EVAL HT TRIACS/ST7LITE1B
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-7631-5; T1235H-6T

T1235H, T1250H Series
Figure 9.
Figure 11. Leakage current versus junction
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
0.1
50
V
V
DRM
DRM
Relative variation of critical rate of
decrease of main current (dI/dt)c
versus reapplied (dV/dt)c
(typical values)
temperature for different values of
blocking voltage (typical values)
=V
=V
RRM
RRM
75
=200 V
=200 V
1.0
V
V
DRM
DRM
(dV/dt)
=V
=V
RRM
RRM
T
=400 V
=400 V
j
C
(°C)
100
(V/µs)
V
V
DRM
DRM
10.0
=V
=V
RRM
RRM
=600 V
=600 V
125
100.0
150
Figure 10. Relative variation of critical rate of
Figure 12. Variation of thermal resistance
8
7
6
5
4
3
2
1
0
80
70
60
50
40
30
20
10
0
25
0
5
50
decrease of main current versus
junction temperature
junction to ambient versus copper
surface under tab (Epoxy printed
circuit board FR4,
copper thickness = 35 µm)
10
15
75
T
S
j
CU
(°C)
20
(cm²)
100
25
Characteristics
30
125
35
D²PAK
150
40
5/10