5103308-5 TE Connectivity, 5103308-5 Datasheet - Page 66

• Manufacturer Part Number: 5103308-5
• Description: Conn Shrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Shrouded Headerr
• Series: AMP-LATCHr

Specifications of 5103308-5

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 20
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch (mm): 2.54mm
• Number Of Contact Rows: 2
• Mounting Style: Through Hole
• Body Orientation: Straight
• Operating Temp Range: -65C to 105C
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 250VAC
• Contact Material: Copper Alloy
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 9.85mm
• Product Length (mm): 33.02mm
• Product Depth (mm): 9.14mm
• Connector Type: Wire To Board
• Contact Termination: Through Hole
• No. Of Contacts: 20
• No. Of Rows: 2
• Pitch Spacing: 2.54mm
• Rohs Compliant: Yes
• Color: Black
• Insulation Type: Thermoplastic
• Material, Contact: Copper Alloy
• Primary Type: Pin Headers
• Termination: Solder
• Product Line: AMP-LATCH
• Profile: Low
• Pcb Mounting Orientation: Vertical
• Pcb Mount Retention: Without
• Mating Connector Lock: Without
• Housing Style: 4-Sided
• Ejection Latches: Without
• Post Size (mm [in]): 0.64 [.025]
• Shrouded: Yes
• [shrouded] End Dimension (mm [in]): 3.81 [0.150]
• Current Rating (a): 1
• Insulation Resistance (m?): 5,000
• Termination Post Length (mm [in]): 3.05 [0.120]
• Solder Tail Contact Plating: Tin over Nickel
• Header Type: Pin Header
• Number Of Positions: 20
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Daisy Chain: With
• Preloaded: Yes
• Contact Plating, Mating Area, Material: Gold (15), Gold Flash over Palladium Nickel
• Contact Shape: Square
• Contact Base Material: Copper Alloy
• Connector Style: Header - Pin
• Mating Alignment Type: Center, Dual Polarizing Bar
• Mating Alignment: With
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• Temperature Rating: Standard
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

5
150
The Reliable Plated-Through Hole Interconnect
Solderless interconnections have been popular in electrical
and electronic applications with world-wide success for
decades. They provide reliable electrical and mechanical
stability and offer applied-cost savings across the board.
For PC board applications, compliant ACTION PIN posts
provide these features:
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Since compliant ACTION PIN posts do not have to be
soldered, problems associated with solder are eliminated,
such as:
Solderless press-fit interconnections using compliant pins
are primarily integrated in, but not limited to, backplanes.
Solderless press-fit interconnections are used in racks,
especially where connectors must be fixed on the solder
side of the PC board and/or component side. In these
applications, the holes for ACTION PIN post connectors are
covered during the soldering process and press-fitting is
performed after soldering.
Other applications for ACTION PIN post interconnections
include PC boards that incorporate components using
surface mount technology (SMT). Here, too, press-fit
interconnections can be applied after soldering, thus
eliminating complications associated with connectors
suitable for surface mounting.
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Large gas-tight contact zone
High reliability due to stored energy
More resistant to damage to plated-through holes during
installation
Especially suited for multilayer PC boards
Less costly board manufacturing due to larger hole
tolerances compared to use of solid pins
Application can be made by end-user
Repairability—contact can be replaced in the same pin
location (two repairs)
Installation with no heat cycling of board
Permits mass insertion by minimizing forces needed to
insert pins as compared to solid pin press-fit application
Significant applied-cost savings in many applications
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Faulty solder joints
Solder fumes; contaminants are deposited on the
contacts
Solder spots; short circuits between printed circuits
Flux residuals
Thermal strain on printed circuit boards and
components
Degassing of plated-through holes
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
ACTION PIN Press-Fit Posts
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Principle of the Compliant ACTION PIN Post
When a compliant ACTION PIN post is inserted into a
plated-through hole, two spring members are compressed,
exerting force against the hole for a gas-tight connection.
The diameter of the hole is smaller than the diagonal size of
the pin (see cross-section illustration below).
The beam characteristics of the pin are designed so that a
plastic, as well as an elastic, deformation takes place during
insertion. The two spring members compress to different
degrees to accommodate hole tolerances. The compliant
pin also reduces strain on the board. With a rigid pin, the
elastic strain energy is stored entirely in the board, leading
to damage of the plated-through holes. With the compliant
ACTION PIN post, the residual force of the elastic
deformation maintains stored energy to produce a tight
contact zone between the pin and the plated-through hole.
This maintains long-term electrical and mechanical
reliability of the interconnection.
Cross-Section Area of ACTION PIN Press-Fit Post in Printed Circuit
Board Holes
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
.037 [0.94]
Minimum
Hole Dia.
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
Maximum
.043 [1.09]
Hole Dia.