87230-7 TE Connectivity, 87230-7 Datasheet - Page 67

• Manufacturer Part Number: 87230-7
• Description: Conn Unshrouded Header HDR 14 POS 2.54mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU MOD II Seriesr

Specifications of 87230-7

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 14
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Rohs Compliant: YES
• Product Type: Headers - Pin Strip
• Number Of Positions / Contacts: 14
• Row Spacing: 2.54 mm
• Mounting Style: PCB
• Mounting Angle: Right
• Termination Style: Solder
• Housing Material: Thermoplastic, Glass Filled
• Contact Material: Phosphor Bronze
• Current Rating: 3 A
• Operating Temperature Range: - 65 C to + 105 C
• Mount Angle: Right Angle
• Pcb Mount Retention: Without
• Surface Mount Compatible: No
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 8.08 [0.318]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 2.79 [0.110]
• Solder Tail Contact Plating: Gold Flash over Nickel
• Header Type: Standard
• Number Of Positions: 14
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Housing: No
• High Speed Serial Data Connector: No
• Lead Free Status / Rohs Status: Details

PC Board Thickness
ACTION PIN posts are
designed for use in a variety
of PC board thicknesses.
However, certain ACTION
PIN posts are to be used in
specific ranges of board
thicknesses. To promote
optimum
performance, the
recommended board
thicknesses provided with
the connector being used
must be followed.
ACTION PIN Post/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
**Radial hole distortion.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
ACTION PIN Contact
Material Thickness
.025 [0.64]
.0453
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
Drilled Hole
Diameter
±.001
[1.151
AMPMODU Interconnection System
ACTION PIN Press-Fit Posts
ACTION PIN posts provide a more reliable press-fit
connection. Localized pressure in the interface area provides
oxide break-through and prevents corrosion better in many
of the harshest environments to help provide a reliable
connection. Also, radial and axial distortion are controlled to
meet today’s standards for multilayer board applications.
➁
±0.03
]
.001-.003 [0.03-0.08] .0003 [0.008]Min.
Copper
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Plating Thicknesses
➂
*
➄
➁
Tin-lead
(Continued)
➃
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
➀
➃
.037-.043 [0.94-1.09]
➂
Plated-Through
Hole Diameter
➄
➀ Annular Ring (See Note)
➁ Drilled Hole
➂ Copper Thickness
➃ Tin-lead Thickness
➄ Plated-Through Hole
.0015 [0.038]
Average
Distortion Specification*
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
Maximum
.002 [0.05]
151
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