146134-1 TE Connectivity, 146134-1 Datasheet - Page 43

• Manufacturer Part Number: 146134-1
• Description: Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST SMD
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr

Specifications of 146134-1

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 4
• Gender: HDR
• Contact Plating: Tin-Lead Over Nickel
• Termination Method: Solder
• Rohs Compliant: NO
• Product Type: Connector
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Surface Mount Compatible: Yes
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Breakaway Header: Yes
• Pcb Mounting Orientation: Vertical
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Header Type: Breakaway
• Number Of Positions: 4
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Tin-Lead
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Housing Material: Thermoplastic - GF
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Approved Standards: UL E28476, CSA LR7189
• High Temperature Housing: Yes
• Temperature Range (°c): -65 – +125
• High Temperature Compatible: Yes
• High Speed Serial Data Connector: No

Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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