5177985-6 TE Connectivity, 5177985-6 Datasheet - Page 2

• Manufacturer Part Number: 5177985-6
• Description: Conn Fine Pitch Connector RCP 140 POS 0.8mm Solder ST SMD T/R
• Manufacturer: TE Connectivity
• Type: Fine Pitch Connectorr

Specifications of 5177985-6

• Pitch: 0.8 mm
• Number Of Rows: 2
• Number Of Contacts: 140
• Gender: RCP
• Contact Plating: Gold
• Termination Method: Solder
• Pcb Mounting Orientation: Vertical
• Keyed: Yes
• Sealant: Without
• Cover Material: Steel
• Solder Tail Contact Plating: Tin over Nickel
• Board-to-board Stack Height (mm [in]): 5.00 [0.197], 6.00 [0.236], 7.00 [0.276], 8.00 [0.315]
• Height: 5H
• Number Of Positions: 140
• Locating Post(s): With
• Vacuum Cover: With
• Locating Post Length: 0.5 mm
• Contact Plating, Mating Area, Material: Gold (8)
• Family Name: Free Height
• Contact Base Material: Copper Alloy
• Connector Style: Receptacle
• Housing Color: Natural
• Housing Material: Liquid Crystal Polymer (LCP)
• Ul Flammability Rating: UL 94V-0
• Housing Material Temperature: High
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Tape & Reel

Product Facts
Catalog 889092
Revised 9-06
www.tycoelectronics.com
For parallel board stacking
applications
High density packaging on
0.8 [.031] centerline
spacing
Available sizes from 40 to
200 positions (in 20 position
increments)
Board stacking heights
available from 5 [.197] to
16 [.630] (in 1 [.039]
increments)
Bellows type spring contacts
are resistant to scooping
and stubbing during mating
and unmating
Positioning bosses for
proper on-board orientation
Available packaged
on“tape-and-reel” for
automatic placement per
EIA standards
Recognized under the
Component Program of
Underwriter
Laboratories Inc.,
File No. E28476
R
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
0.8mm Free Height (FH) Connectors
Tyco Electronics 0.8mm FH
surface-mount connectors
are designed for parallel
board stacking applications
using subminiature connec-
tors to meet today’s elec-
tronic industry requirements
for high density packaging.
It is possible to save more
than 50% of the required
board space when com-
pared to conventional 1.27
[.050] centerline connectors.
0.8mm FH connectors are
ideally suited for application
downsizing, such as note-
book PCs, pen pads, cellu-
lar telephones and other
electronic equipment
requiring miniature connec-
tor packaging.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Vertical board-mount plugs
and receptacles are avail-
able. By mating combina-
tions of plug and receptacle
housing heights, board-to-
board stacking heights from
5 [.197] to 16 [.630] (in 1
[.039] increments) can be
achieved.
The receptacles are
preloaded with the
Tyco Electronics unique
bellows-type spring con-
tacts for reliable electrical
connection with the plugs.
In addition, right angle
plugs are available
which mate to standard
receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Performance Characteristics
Voltage Rating — 100 VAC
Current Rating — 0.5 ampere
Contact Resistance —
30 milliohms max. (initial)
Dielectric Withstanding Voltage —
500 VAC (1 minute)
Operating Temperature —
-40°C to +85°C (Including terminal
temperature rise)
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
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