FAR-G6KZ-1G8425-Y4WY-Z Taiyo Yuden, FAR-G6KZ-1G8425-Y4WY-Z Datasheet - Page 10

• Manufacturer Part Number: FAR-G6KZ-1G8425-Y4WY-Z
• Description: FILTER SAW 1.8425GHZ DCS+EGSM
• Manufacturer: Taiyo Yuden

Specifications of FAR-G6KZ-1G8425-Y4WY-Z

• Frequency: 1.843GHz Center
• Bandwidth: 75MHz
• Filter Type: Bandpass
• Insertion Loss: 1.6dB
• Applications: Cellular, GSM
• Package / Case: *
• Mounting Type: Surface Mount
• Rohs Compliant: Yes
• Frequency Min: 1GHz
• Frequency Max: 5GHz
• Bandpass Insertion Loss Max: 1.8dB
• No. Of Pins: 10
• Termination Type: SMD
• Msl: MSL 1 - Unlimited
• Size: 1.8 1.4 0.5
• Reel Quantity: 3000
• Filter Terminals: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-2857-2

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Duplexer
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
sawfil_reli_e-01
1. Terminal stregth
Specifications
Conditions
2. Mechanical shock
Specifications
Conditions
3. Vibration
Specifications
Conditions
4. Drop 1
Specifications
Conditions
5. Drop 2
Specifications
Conditions
Specifications
Conditions
７ . Static humidity
Specifications
Conditions
8. High temperature storage life
Specifications
Conditions
9. Low temperature storage life
Specifications
Conditions
10. High Temperature Bias
Specifications
Conditions
11. Solderbility 1
Specifications
Conditions
12. Solderbility 2
Specifications
Conditions
13. Solder heat resistance
Specifications
Conditions
◆Recommended temperature profile of reflow soldering
Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.
Suitable condition for solder heating is differed depending on composition and manufacturing method.
Please contact to solder manufacturer for the details.
6. Temperature cycling
For details of each product (characteristics graph,
RELIABILITY DATA
Temperature （ ℃）
300
250
200
150
100
50
Ambient temperature
rise slope
: 1~4℃/sec.
50~110sec.
Pre-Heating
150~180℃
30∼50sec.
10sec.
reliability
Ambient temperature
cool slope
: 1~4℃/sec.
Temperature in heat condition
: 230℃min. 50sec. max.
Temperature of upper surface of package
and PCB surface.
: 260℃min. 10sec. max.
information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
No damage to be found.
Bend width 4mm, hold for 5＋/－1 sec.
according to IEC60068-2-21(JISC60068-2-21)
After testing, meet the specified characteristics at a room temperature.
Apply 14700m/s
according to IEC68-2-27(JISC60068-2-27).
After testing, meet the specified characteristics at a room temperature.
With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s
vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)
After testing, meet the specified characteristics at a room temperature.
Drop 3 times onto concrete floor from the height of 1.0m.
After testing, meet the specified characteristics at a room temperature.
Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.
After testing, meet the specified characteristics at a room temperature.
Temp. range －40 to ＋100℃. 500cycle.
After testing, meet the specified characteristics at a room temperature.
＋85℃, 90% to 95%RH, apply DC5V, 1000hours.
After testing, meet the specified characteristics at a room temperature.
＋100℃, 1000hours.
After testing, meet the specified characteristics at a room temperature.
－40℃, 1000hours.
After testing, meet the specified characteristics at a room temperature.
＋50℃, ＋29dBm, 50000hours.
More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Lead-free Solder paste, Reflow；Peak temperature 245℃
More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Sn-Pb Solder paste, Reflow；Peak temperature 235℃
After testing, meet the specified characteristics at a room temperature.
A change of the remarkable appearance do not have it.
Temperature profile of reflow soldering is as follows (Figure).
Solder
Board
45±2
2
for 0.5ms 5 times for each of 6 directions.
Ｒ340
45±2
Device
1.6±0.20
1 1
2
of acceleration at 55 to 500Hz, apply a
sawfil_reli-PRP3