251G Aavid Thermalloy, 251G Datasheet - Page 87

• Manufacturer Part Number: 251G
• Description: THERMAL GREASE
• Manufacturer: Aavid Thermalloy
• Series: Thermalcotetrade;r
• Type: Silicon Compoundr

Specifications of 251G

• Size / Dimension: 1 lb Can
• Product: Thermal Management
• Size: 1 lb
• Container: Can
• Chemical Component: Polydimethylsiloxane/Zinc Oxide
• Dispensing Method: Aerosol
• Primary Type: Grease
• Temperature, Rating: -40 to +204 °C
• Weight: 1 lbs.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 35270

Hi-Flow® *
Alignment Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
ORDERING INFORMATION
Suffix
8223-CL03G
8241-CL11G
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Ordering code
0
7
8
* Hi-Flow® is a registered trademark of the Bergquist Company
ORDERING INFORMATION
www.aavidthermalloy.com
Thermalloy origin part 7022B–8223–CL03 G
example 12 digit part
Two Hi-Flow® pads
One Hi-Flow® pad
Device
TO-220
TO-218
Typical installation
Shown with part number 8241-CL11
Description
No pads
example
Figure
A
B
CLIP ASSEMBLY
C L
1
530101B _ 5150G
AMERICA
A
A = Model number
B = Alignment pad
C = RoHS compliant
EUROPE
Ordering code
B
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
USA Tel: [phone] email: [e-mail]
C
2X
TO-3
ø
(0.093)
2.36
(1.650)
41.91
(0.985)
Figure A
DEVICE MANUFACTURERS
25.02
Recommended hole pattern for 8223-CL03G
PLATED THRU HOLE PER
2X
RECOMMENDATION
ø
(0.140)
3.56
(1.200)
(1.000)
(0.122)
30.48
(0.100)
25.40
3.10
2.54
(1.140)
28.96
(0.290)
7.37
(0.580)
14.73
(0.520)
(0.030)
13.21
0.76
(0.100)
2.54
(0.116)
2.95
(0.750)
19.05
TO-220
(0.370)
DIA PLATED
THRU HOLE
9.40
(0.128)
(0.200)
3.25
5.08
MATERIAL PROPERTIES
Thermal impedance vs. pressure
Pressure
TO-220 Thermal performance (ºC/W)
Reinforcement carrier
Thickness
Continuous use temp (°C)
Phase change temp(°C)
Dielectric breakdown voltage (Vac)
Dielectric constant (1000 Hz)
Volume resistivity (Ohm-meter)
ASIA
(0.860)
(0.500)
21.84
12.70
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
Interface Material/Pads
Figure B
Recommended hole pattern for 8241-CL11G
(0.147)
(0.563)
14.30
(0.063)
3.73
1.60
(0.560)
14.22
DIA
DIA PLATED
THRU HOLE
(0.215)
TYP(3)
5.46
(0.500)
12.70
(0.300)
7.62
(0.670)
(0.460)
17.02
11.68
TYP THK
(0.860)
(0.020)
21.84
0.51
(1.000)
0.127 (0.005)
25.40
1.15
TO-218
10
Polymide
5000
1012
(0.030)
150
4.5
55
(0.125)
0.76
3.18
(0.790)
1.14
20.07
(0.215)
25
(0.740)
5.46
18.80
(0.116)
2.95
1.12
50
DIA PLATED
THRU HOLE
TYP(2)
(0.200)
5.08
(0.160)
(0.660)
16.76
2.69
200
1.1
(0.860)
DIA
21.84
87