658-25ABT3 Wakefield Thermal Solutions, 658-25ABT3 Datasheet - Page 13

• Manufacturer Part Number: 658-25ABT3
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-25ABT3

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 2W @ 40°C
• Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1096

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
3
2
1
0
7
6
5
4
3
2
1
0
4
3
2
1
0
100
100
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
100
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
500
500
500
500
500
600
600
600
600
600
700
700
700
700
700
3
2
1
0
1