624-25ABT4 Wakefield Thermal Solutions, 624-25ABT4 Datasheet - Page 19

• Manufacturer Part Number: 624-25ABT4
• Description: HEATSINK CPU 21MM SQ W/DBL TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 624r

Specifications of 624-25ABT4

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 21.00mm x 21.00mm
• Thermal Resistance @ Forced Air Flow: 25°C/W @ 200 LFM
• Packages Cooled: BGA / LED
• Width: 21mm
• Heat Sink Material: Aluminum
• Length: 21mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 21 mm L x 21 mm W x 6.4 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1059

18 x 18 PGA
17 x 17 SPGA
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