2292BG Aavid Thermalloy, 2292BG Datasheet
2292BG
Manufacturer Part Number
2292BG
Description
BOARD LEVEL HEAT SINK
Manufacturer
Aavid Thermalloy
Datasheet
1.2292BG.pdf
(3 pages)
Specifications of 2292BG
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
28.58mm Dia
Power Dissipation @ Temperature Rise
1.5W @ 40°C
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 400 LFM
Product
Heatsinks
Mounting Style
Adhesive
Fin Style
Radial
Dimensions
7.62 mm H
Designed For
68 Position Devices, Microprocessors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Height
-
Package Cooled
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
34182
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Radial Fin Heat Sinks for Microprocessors
Part Number: 2283BG
Part Number: 2286BG<
Products
Bond-on heat sinks for leadless chip carriers and flat packs.
Primarily designed for 68-position devices.
The 2283 is ideally suited to limited board space applications with high air flow.
/
BGA
/
Radial Fins
---Useful Links---
6
Page 1 of 3
4/19/2010
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2292BG Summary of contents
Page 1
Heat Sinks by Product - radial fin Products Radial Fin Heat Sinks for Microprocessors Search by part # Bond-on heat sinks for leadless chip carriers and flat packs. Primarily designed for 68-position devices. The 2283 is ideally suited to limited ...
Page 2
... Heat Sinks by Product - radial fin Part Number: 2288BG Part Number: 2292BG Part Number: 2296BG http://www.aavidthermalloy.com/products/bga/radial.shtml Page 4/19/2010 ...
Page 3
Heat Sinks by Product - radial fin http://www.aavidthermalloy.com/products/bga/radial.shtml Page 4/19/2010 ...