MMZ1608Y152CT TDK Corporation, MMZ1608Y152CT Datasheet
MMZ1608Y152CT
Manufacturer Part Number
MMZ1608Y152CT
Description
FERRITE CHIP 1500 OHM 300MA 0603
Manufacturer
TDK Corporation
Series
MMZr
Datasheet
1.MMZ1608Y152CT.pdf
(4 pages)
Specifications of MMZ1608Y152CT
Impedance @ Frequency
1.5K Ohm @ 100MHz
Current Rating
300mA
Dc Resistance (dcr)
500.0 mOhm Max
Filter Type
Differential Mode - Single
Number Of Lines
1
Package / Case
0603 (1608 Metric)
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4046079
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1608-C Type
FEATURES
• Two sizes: 1.6× 0.8× 0.6 and 1.6× 0.8× 0.8mm. Chip
• Layout of the interior electrode structure has been optimized,
• Size standardized for use by automatic assembly equipment.
• Either flow or reflow soldering method can be used due to
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
• Low DC resistance structure of electrode prevents wasteful
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Personal computers,CRTs, liquid crystal display panels, printers,
hard disk drives, game machines, cellular phones, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
(5) Characteristic type
(6) Packaging style
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MMZ 1608 R 121 C
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1)
bead(impeder) built using 5-materials construction.
thereby improving high frequency characteristics, decreasing
Rdc, and lowering height.
No preferred orientation.
electroplating of the terminal electrodes.
while preventing crosstalk between circuits.
electric power consumption.
soldering.
121:120Ω at 100MHz
T:Taping
(2)
Preheating
60 to 120s
(3) (4) (5) (6)
Time(s)
T
Soldering
30 to 60s
10s max.
Natural
cooling
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
R material: For wide frequency applications calling for broad
S material: Standard type that features impedance characteristics
Y material: High frequency range type intended for the 100MHz
D material: For applications calling for low insertion loss at low fre-
TYPICAL MATERIAL CHARACTERISTICS
10000
1000
100
10
1
1
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (200 to 500MHz) for signal line applications.
S
Y
10
B
Frequency ( MHz )
D
R
006-02 / 20061022 / e9415_mmz_c.fm
Conformity to RoHS Directive
100
1000
(1/4)
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MMZ1608Y152CT Summary of contents
Page 1
Chip Beads(SMD) For Signal Line MMZ Series MMZ1608-C Type FEATURES • Two sizes: 1.6× 0.8× 0.6 and 1.6× 0.8× 0.8mm. Chip bead(impeder) built using 5-materials construction. • Layout of the interior electrode structure has been optimized, thereby improving high frequency ...
Page 2
SHAPES AND DIMENSIONS/ RECOMMENDED PC BOARD PATTERN 1.6±0.15 0.3±0.2 Thickness ( T ) Weight 3mg 0.6±0.15mm 4mg 0.8±0.15mm TEMPERATURE RANGES Operating/storage –55 to +125°C PACKAGING STYLE AND QUANTITIES Packaging style Quantitiy Taping 4000 pieces / reel TYPICAL ELECTRICAL CHARACTERISTICS Z, ...
Page 3
TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608R102C 1600 1400 1200 1000 800 Z 600 R 400 X 200 100 1000 10000 Frequency ( MHz ) MMZ1608S800C 500 400 300 200 100 ...
Page 4
TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608Y102C 1600 1400 1200 1000 Z 800 R 600 400 X 200 100 1000 10000 Frequency ( MHz ) MMZ1608D050C ...