LI0201C800R-10 Laird Technologies, LI0201C800R-10 Datasheet - Page 5

• Manufacturer Part Number: LI0201C800R-10
• Description: FERRITE CHIP 80OHM 300MA 0201
• Manufacturer: Laird Technologies
• Series: Stewardr

Specifications of LI0201C800R-10

• Impedance @ Frequency: 80 Ohm @ 100MHz
• Current Rating: 300mA
• Dc Resistance (dcr): 600.0 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Package / Case: 0201 (0603 Metric)
• Mounting Type: Surface Mount
• Product: Chip Ferrite Beads
• Impedance: 80 Ohms
• Maximum Dc Current: 300 mAmps
• Maximum Dc Resistance: 0.6 Ohms
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 240-2594-2

LEAD-FREE/ROHS COMPLIANCE
All Laird Technologies’ surface mount and through hole EMI components (including assemblies with wire and cofired monolithic ferrite
chip beads and common mode chokes) are available lead-free and RoHS compliant.
PART NUMBERING SYSTEM
Lead-free board level part numbers are differentiated by a suffix descriptor. The suffix (-10) identifies the part number for all lead-free
parts. This part number suffix is for use on board level part numbers only.
PART NUMBER EXAMPLES
All Laird Technologies’ new and old ferrite cable cores are RoHS compliant. No part number change for cable cores.
COMPOSITION
Laird Technologies’ lead-free component terminations and wire platings are 100% matte Tin (Sn) over a Nickel (Ni) barrier and are
reverse compatible with existing Tin (Sn)/Lead (Pb) materials.
Concerns over the use of pure tin coatings on component leads and terminations, due to the possibility of tin whiskering, are still under
industry discussion. Electroplating 100% matte tin over a nickel barrier is recognized as an effective whisker growth mitigation strategy
that is accepted by most industry groups. Laird Technologies’ maintains a minimum plating thickness of 2.5µm [99µin] of Tin, and
0.7µm [28µin] of Nickel.
RECOMMENDED LEAD-FREE
SOLDERING PROFILE
While Laird Technologies’ lead-free surface mount and
through hole components are reverse compatible with
existing Sn/Pb materials, higher peak temperatures (up to
260°C) provide better wetting characteristics during the
solder reflow process. The higher reflow temperatures
typically used for lead-free processes will not damage
Laird Technologies’ surface mount components, but
the delta T between the board and larger components
must be considered. Smaller delta Ts can be achieved
with slower belt speed to increase the pre-heat time.
Soldering cycle time (throughput) must be balanced with
reflow temperature. Allowance must be made for the
coldest part (largest heat sink) to solder, considering the
thermal mass of the board and size of the components.
Innovative Technology
global
USA: +1 800 634.2673
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
+1 423 308.1690
for a Connected World
solutions:
Old Part
New Part
local
HZ0805E601R-00
HZ0805E601R-10
support
TM
contains lead
is lead-free
Old Part
New Part 28F0121-0SR-10 is lead-free
28F0121-0SR
contains lead
Ferrite Chip Beads
Application Notes
LI0201