CM1242-33CP ON Semiconductor, CM1242-33CP Datasheet
CM1242-33CP
Specifications of CM1242-33CP
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CM1242-33CP Summary of contents
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... CM1242-33CP -Channel ESD Protection 1 Device in 0201 CSP Description The CM1242−33CP is a 2−bump ESD protection device in 0201 CSP form factor fully compliant with IEC 61000−4−2. The II CM1242−33CP is also RoHS compliant and has a pure tin finish. Table 1. PIN DESCRIPTIONS ...
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Table 2. STANDARD OPERATING CONDITIONS Parameter Storage Temperature Range Operating Temperature Range Maximum Input Voltage Table 3. ELECTRICAL OPERATING CHARACTERISTICS Symbol Parameter V Breakdown Voltage B I Channel Leakage Current LEAK C Channel Input Capacitance IN V ESD Protection Peak ...
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... CM1242−33CP Mechanical Specifications The CM1242−33CP is supplied in a 2−bump Chip Scale Package (CSP). Dimensions are presented below. Table 4. CSP TAPE AND REEL SPECIFICATIONS Part Number Chip Size (mm) CM1242−33CP 0.60 X 0.30 X 0.275 Top Cover Tape K 0 MECHANICAL SPECIFICATIONS Pocket Size (mm) ...
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... CONTROLLING DIMENSION: MILLIMETERS. MILLIMETERS DIM MIN MAX A 0.25 0.30 A1 0.00 0.05 0.14 0. 0.60 BSC E 0.30 BSC e 0.36 BSC L 0.19 0.24 2X 0.33 0.81 DIMENSIONS: MILLIMETERS ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM1242−33CP/D ...