MCP1700T-3102E/TT Microchip Technology, MCP1700T-3102E/TT Datasheet - Page 13

• Manufacturer Part Number: MCP1700T-3102E/TT
• Description: 250mA CMOS LDO, Isupply 1uA And 2% Vout Accuracy 3 SOT-23 T/R
• Manufacturer: Microchip Technology

Specifications of MCP1700T-3102E/TT

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.1V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 0.178V @ 250mA
• Number Of Regulators: 1
• Current - Output: 250mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6.0
6.1
The MCP1700 is most commonly used as a voltage
regulator. It’s low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1700 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(1.6 µA x V
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
The
temperature specified for the MCP1700 is +125
estimate the internal junction temperature of the
MCP1700, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (Rθ
ambient for the SOT-23 pin package is estimated at
230
© 2007 Microchip Technology Inc.
I
150 mA
P
V
V
OUT
Input Voltage Range = 2.3V to 3.2V
LDO
IN(MAX)
OUT(MIN)
°
P
V
1.8V
C/W.
LDO
OUT
maximum
= LDO Pass device internal power dissipation
APPLICATION CIRCUITS &
ISSUES
Typical Application
Power Calculations
Package Type = SOT-23
V
=
= Maximum input voltage
V
IN
IN
APPLICATION INPUT CONDITIONS
POWER DISSIPATION
= LDO minimum output voltage
JA
OUT
(
). The following equation can be used to
maximum = 3.2V
V
). The thermal resistance from junction to
IN MAX )
C
1 µF Ceramic
typical = 1.8V
(
OUT
GND
V
I
OUT
OUT
continuous
MCP1700
Typical Application Circuit.
)
–
= 150 mA maximum
V
OUT MIN
(
V
IN
operating
)
) I
V
(2.3V to 3.2V)
×
IN
1 µF Ceramic
OUT MAX )
C
IN
(
junction
°
C
)
.
To
EQUATION 6-2:
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
EQUATION 6-4:
EQUATION 6-5:
T
temperature.
P
Rθ
T
P
T
T
Rθ
T
P
Rθ
T
T
T
AMAX
A(MAX)
A
J(MAX)
TOTAL
J(MAX)
J(RISE)
TOTAL
J
J(RISE)
D(MAX)
JA
JA
JA
= Junction Temperature.
= Ambient temperature.
= Thermal resistance from junction to ambient.
= Thermal resistance from junction to ambient.
= Thermal resistance from junction to ambient.
= Maximum ambient temperature.
T
= Total device power dissipation.
= Maximum device power dissipation.
= Maximum continuous junction
= Maximum continuous junction
= Maximum ambient temperature.
J MAX
= Maximum device power dissipation.
= Rise in device junction temperature over
= Rise in device junction temperature over
P
(
temperature.
D MAX
the ambient temperature.
the ambient temperature.
T
(
J RISE
(
)
T
=
)
J
=
P
)
=
TOTAL
=
(
---------------------------------------------------
T
T
J RISE
P
J MAX
(
(
D MAX
(
×
Rθ
Rθ
)
)
MCP1700
+
–
)
JA
JA
×
T
T
A
A MAX
Rθ
+
(
T
DS21826B-page 13
JA
AMAX
)
)