PIC16F722-E/ML Microchip Technology, PIC16F722-E/ML Datasheet - Page 185

3.5 KB Flash, 1.8V-5.5V, 16 MHz Int. Osc 28 QFN 6x6mm TUBE

PIC16F722-E/ML

Manufacturer Part Number
PIC16F722-E/ML
Description
3.5 KB Flash, 1.8V-5.5V, 16 MHz Int. Osc 28 QFN 6x6mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr

Specifications of PIC16F722-E/ML

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
17.2.10
When the CKP bit is cleared, the SCL output is held low
once it is sampled low. therefore, the CKP bit will not
stretch the SCL line until an external I
has already asserted the SCL line low. The SCL output
will remain low until the CKP bit is set and all other
devices on the I
ensures that a write to the CKP bit will not violate the
minimum
(Figure 17-14).
FIGURE 17-14:
© 2009 Microchip Technology Inc.
SSPCON
SDA
CKP
SCL
WR
CLOCK SYNCHRONIZATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
high
2
C bus have released SCL. This
time
CLOCK SYNCHRONIZATION TIMING
requirement
DX
2
C master device
for
Master device
asserts clock
SCL
PIC16F72X/PIC16LF72X
17.2.11
While in Sleep mode, the I
addresses of data, and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if SSP interrupt is enabled).
Master device
deasserts clock
SLEEP OPERATION
2
C module can receive
DS41341E-page 185
DX-1

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