PIC18F27J53T-I/SO Microchip Technology, PIC18F27J53T-I/SO Datasheet - Page 3

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PIC18F27J53T-I/SO

Manufacturer Part Number
PIC18F27J53T-I/SO
Description
28-pin, USB, 128KB Flash, 4KB RAM, 12 MIPS, 12-bit ADC, NanoWatt XLP 28 SOIC .30
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets

Specifications of PIC18F27J53T-I/SO

Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
128KB (64K x 16)
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
16
Number Of Timers
8
Operating Supply Voltage
2.15 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Silicon Errata Issues
1. Module: Charge Time Measurement Unit
2. Module: Phase Locked Loop (PLL)
 2010 Microchip Technology Inc.
Note:
When using the CTMU, the constant current
source may not output if the internal band gap
reference is not enabled.
Work around
Before using the CTMU, the internal band gap ref-
erence module should be manually enabled by
setting the VBGEN bit to ‘1’ (ANCON1<7> = 1).
Affected Silicon Revisions
When OSCCON<6:4> are configured to settings
other than a 4 MHz or 8 MHz INTOSC post-
scaler, the PLLEN bit (OSCTUNE<6>) is forced
to ‘0’, even if firmware tries to set the PLLEN bit.
This may prevent firmware from enabling the
PLL.
Work around
Before attempting to set the PLLEN bit, config-
ure OSCCON<6:4> to ‘0b110’ or ‘0b111’ to
select the 4 MHz or 8 MHz INTOSC postscaler.
Affected Silicon Revisions
A1
A1
X
X
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A1).
(CTMU)
PIC18F47J53 FAMILY
3. Module: Analog-to-Digital Converter
At the beginning of sample acquisition, one or
more small pull-up pulses (approximately 25 ns
long) may output to the currently selected ANx
analog channel. These pulses can lead to a pos-
itive offset error when the analog signal voltage
is near V
is unable to dissipate the added pull-up voltage
before the A/D conversion occurs.
Work around
Do one or more of the following:
• Use the “0 T
• Use a longer A/D acquisition time setting to
• Use low-impedance, active analog signal
• Experiment with external filter capacitor val-
Small filter capacitor values (or none at all) will
allow time for the external analog signal driver to
dissipate the pull-up voltage quickly. Alternately,
large filter capacitor values will prevent the short
pull-up pulses from increasing the final voltage
enough to cause an A/D conversion error.
Affected Silicon Revisions
A1
start the next sample acquisition period imme-
diately following an A/D conversion
completion.
This allows the external analog signal driver
more time to dissipate the pull-up pulses that
occur when the sample acquisition is started.
provide time for the external analog signal
driver to dissipate the pull-up pulse voltage.
drivers to reduce the time needed to dissipate
the pull-up pulse voltage.
ues to avoid allowing the pull-up voltage offset
to affect the final voltage that gets converted.
X
SS
(ADC)
and the external analog signal driver
AD
” A/D acquisition time setting to
DS80506C-page 3

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