PIC24HJ256GP610T-I/PT Microchip Technology, PIC24HJ256GP610T-I/PT Datasheet - Page 2

256KB, Flash, 16384bytes-RAM, 40MIPS, 85I/O, 16-bit Family 100 TQFP 12x12x1mm T/

PIC24HJ256GP610T-I/PT

Manufacturer Part Number
PIC24HJ256GP610T-I/PT
Description
256KB, Flash, 16384bytes-RAM, 40MIPS, 85I/O, 16-bit Family 100 TQFP 12x12x1mm T/
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ256GP610T-I/PT

Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (85.5K x 24)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b, 32x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Number Of Timers
13
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (12 bit, 32 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ256GP610T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC24H ENGINEERING SAMPLES
10. 12-bit ADC Module
11. 10-bit ADC Module
12. DMA Module: Interaction with EXCH Instruction
13. DISI Instruction
14. JTAG Programming
DS80260B-page 2
For this revision of silicon, the 12-bit ADC module
INL and DNL, conversion speed and signal acqui-
sition time parameters are not within the published
data sheet specifications.
For this revision of silicon, the 10-bit ADC module
INL, DNL and signal acquisition time parameters
are not within the published data sheet
specifications.
The EXCH instruction does not execute correctly
when one of the operands contains a value equal
to the address of the DMAC SFRs.
The DISI instruction will not disable interrupts if a
DISI instruction is executed in the same instruc-
tion cycle that the DISI counter decrements to
zero.
JTAG programming will not work in silicon revision
A0/A1.
15. Internal FRC Oscillator
16. ECAN™ Loopback Mode
17. Clock Switch From Fail-Safe Clock Source
18. I
The following sections will describe the errata and work
around to these errata, where they may apply.
The internal FRC oscillator is not calibrated in
silicon revision A0/A1.
The ECAN module (ECAN1 or ECAN2) does not
function correctly in Loopback mode.
Once a clock fail interrupt has occurred, the clock
source cannot be switched from the fail-safe clock
source.
The I
when it detects bus activity.
2
C™ Module
2
C module does not wake-up from Sleep
© 2006 Microchip Technology Inc.

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