SSM2302CPZ-REEL Analog Devices Inc, SSM2302CPZ-REEL Datasheet - Page 4

IC,Audio Amplifier,DUAL,LLCC,16PIN,PLASTIC

SSM2302CPZ-REEL

Manufacturer Part Number
SSM2302CPZ-REEL
Description
IC,Audio Amplifier,DUAL,LLCC,16PIN,PLASTIC
Manufacturer
Analog Devices Inc
Type
Class Dr
Datasheet

Specifications of SSM2302CPZ-REEL

Output Type
2-Channel (Stereo)
Max Output Power X Channels @ Load
1.4W x 2 @ 8 Ohm
Voltage - Supply
2.5 V ~ 5 V
Features
Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Mounting Type
Surface Mount
Package / Case
16-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
SSM2302Z-EVAL - BOARD EVAL FOR SSM2302
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SSM2302CPZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
SSM2302
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 2.
Parameter
Supply Voltage
Input Voltage
Common-Mode Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
(Soldering, 60 sec)
Rating
6 V
V
V
−65°C to +150°C
−40°C to +85°C
−65°C to +165°C
300°C
DD
DD
Rev. 0 | Page 4 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
16-lead, 3 mm × 3 mm LFCSP
JA
is specified for the worst-case conditions, that is, a device
θ
44
JA
θ
31.5
JC
Unit
°C/W

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