SSM2305RMZ-R2 Analog Devices Inc, SSM2305RMZ-R2 Datasheet - Page 14

• Manufacturer Part Number: SSM2305RMZ-R2
• Description: Mono 2W Class D Audio Amp
• Manufacturer: Analog Devices Inc
• Type: Class Dr

Specifications of SSM2305RMZ-R2

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 2.8W x 1 @ 4 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Operational Class: Class-D
• Audio Amplifier Output Configuration: 1-Channel Mono
• Output Power (typ): 2.8x1@4OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.02@8Ohm@1W%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 85dB
• Single Supply Voltage (min): 2.5V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: MSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SSM2305
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
SSM2305CPZ-R2
SSM2305CPZ-REEL
SSM2305CPZ-REEL7
SSM2305RMZ-R2
SSM2305RMZ-REEL
SSM2305RMZ-REEL7
SSM2305-EVALZ
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
SEATING
0.90 MAX
0.85 NOM
PLANE
INDICATOR
PIN 1
12° MAX
0.95
0.85
0.75
Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3.25
3.00 SQ
2.75
VIEW
TOP
0.15
0.00
COPLANARITY
3.20
3.00
2.80
PIN 1
Figure 36. 8-Lead Mini Small Outline Package [MSOP]
0.70 MAX
0.65 TYP
0.30
0.23
0.18
0.10
Package Description
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
Evaluation Board with LFCSP Model
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.38
0.22
8
1
3 mm × 3 mm Body, Very Thin, Dual Lead
0.65 BSC
3.20
3.00
2.80
Dimensions shown in millimeters
Dimensions shown in millimeters
2.95
2.75 SQ
2.55
0.20 REF
5
4
0.05 MAX
0.01 NOM
SEATING
PLANE
Rev. A | Page 14 of 16
0.60 MAX
5.15
4.90
4.65
1.10 MAX
0.50
0.40
0.30
(CP-8-2)
(RM-8)
0.23
0.08
0.60 MAX
EXPOSED PAD IS NOT CONNECTED INTERNAL LY.
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
5
4
(BOT TOM VIEW)
EXPOSED
PAD
8°
0°
1
8
1.89
1.74
1.59
0.50
BSC
PIN 1
INDICATOR
0.80
0.60
0.40
1.60
1.45
1.30
Package Option
CP-8-2
CP-8-2
CP-8-2
RM-8
RM-8
RM-8
Branding
Y10
Y10
Y10
Y10
Y10
Y10