SST25LF020A-33-4C-QAE-T Microchip Technology, SST25LF020A-33-4C-QAE-T Datasheet - Page 11

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SST25LF020A-33-4C-QAE-T

Manufacturer Part Number
SST25LF020A-33-4C-QAE-T
Description
3.0V To 3.6V 2Mbit SPI Serial Flash 8 TDFN-S 6x5x0.8mm T/R
Manufacturer
Microchip Technology
Datasheet

Specifications of SST25LF020A-33-4C-QAE-T

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
2M (256K x 8)
Speed
33MHz
Interface
SPI Serial
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
8-WDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SST25LF020A-33-4C-QAE-T
Manufacturer:
NXP
Quantity:
12 000
2 Mbit SPI Serial Flash
SST25LF020A
Byte-Program
The Byte-Program instruction programs the bits in the
selected byte to the desired data. The selected byte must
be in the erased state (FFH) when initiating a Program
operation. A Byte-Program instruction applied to a pro-
tected memory area will be ignored.
Prior to any Write operation, the Write-Enable (WREN)
instruction must be executed. CE# must remain active low
for the duration of the Byte-Program instruction. The Byte-
©2010 Silicon Storage Technology, Inc.
FIGURE 7: Byte-Program Sequence
SCK
CE#
SO
SI
MODE 3
MODE 0
MSB
0 1 2 3 4 5 6 7 8
02
HIGH IMPEDANCE
MSB
11
ADD.
Program instruction is initiated by executing an 8-bit com-
mand, 02H, followed by address bits [A
address, the data is input in order from MSB (bit 7) to LSB
(bit 0). CE# must be driven high before the instruction is
executed. The user may poll the Busy bit in the software
status register or wait T
self-timed Byte-Program operation. See Figure 7 for the
Byte-Program sequence.
15 16
ADD.
23 24
ADD.
31 32
MSB
D
BP
IN
1242 F06.0
LSB
for the completion of the internal
39
23
S71242-07-000
-A
0
]. Following the
Data Sheet
01/10

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