SST39VF200A-70-4I-B3KE Microchip Technology, SST39VF200A-70-4I-B3KE Datasheet - Page 29

• Manufacturer Part Number: SST39VF200A-70-4I-B3KE
• Description: 2.7V To 3.6V 2Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm TRAY
• Manufacturer: Microchip Technology

Specifications of SST39VF200A-70-4I-B3KE

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 2M (128K x 16)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2 Mbit / 4 Mbit / 8 Mbit Multi-Purpose Flash
SST39LF200A / SST39LF400A / SST39LF800A
SST39VF200A / SST39VF400A / SST39VF800A
©2010 Silicon Storage Technology, Inc.
FIGURE 23: 48-Ball Thin-Profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
FIGURE 24: 48-Ball Very-Very-Thin-Profile, Fine-Pitch Ball Grid Array (WFBGA) 4mm x 6mm
Note:
6
5
4
3
2
1
A1 CORNER
1. Complies with JEDEC Publication 95, MO-210, variant AB-1 , although some dimensions ma y be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm ( 0.05 mm)
6
5
4
3
2
1
A1 CORNER
Note:
A B C D E F G H J K L
SST Package Code: B3K
SST Package Code: M1Q
A B C D E F G H
SEATING PLANE
TOP VIEW
SEATING PLANE
SIDE VIEW
1. Complies with JEDEC Publication 95, MO-207, Variant C2B-4, dimensions except nominal ball width is larger.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.08 mm.
4. No ball is present in position A1; a gold-colored indicator is present.
5. Ball opening size is 0.29 mm ( 0.05 mm).
TOP VIEW
DETAIL
8.00 0.20
0.08
6.00
0.35 0.05
0. 06
0.20
0.08
6.00 0.20
4.00
1.10 0.10
0.63 0.10
0.12
0.08
29
4.00
0.80
0.50
2.50
BOTTOM VIEW
H G F E D C B A
L K J H G F E D C B A
SIDE VIEW
BOTTOM VIEW
A1 INDICATOR
5.00
5.60
0.50
0.80
48-wfbga-M1Q-4x6-32mic-6.0
4
6
5
4
3
2
1
(48X)
0.05
A1 CORNER
0.32
6
5
4
3
2
1
48-tfbga-B3K-6x8-450mic-4
1mm
1mm
0.45 0.05
(48X)
S71117-13-000
Data Sheet
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