TC1070VCT713 Microchip Technology, TC1070VCT713 Datasheet - Page 10

• Manufacturer Part Number: TC1070VCT713
• Description: IC,VOLT REGULATOR,ADJUSTABLE,+1.2 TO +5.5V,CMOS,TSOP,5PIN,PLASTIC
• Manufacturer: Microchip Technology

Specifications of TC1070VCT713

• Rohs Compliant: YES
• Regulator Topology: Positive Adjustable
• Voltage - Output: 1.2 ~ 5.5 V
• Voltage - Input: 2.7 ~ 6 V
• Voltage - Dropout (typical): 0.085V @ 50mA
• Number Of Regulators: 1
• Current - Output: 50mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5, SC-74A, SOT-25
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 6 V
• Output Voltage: 1.165 V to 5.5 V
• Output Type: Adjustable
• Dropout Voltage (max): 250 / 400 mV
• Output Current: 50 mA
• Line Regulation: 0.05 %
• Load Regulation: 0.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Reference Voltage: 1.2 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TC1070/TC1071/TC1187
5.0
5.1
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst-case actual power dissipation:
EQUATION 5-1:
The
(Equation
temperature (T
temperature (T
junction-to-air (

EQUATION 5-2:
DS21353E-page 10
Where:
JA
I
LOADmax
V
of approximately 220° C/Watt.
V
OUTmin
INmax
maximum
where all terms are previously defined.
P
THERMAL CONSIDERATIONS
Thermal Shutdown
Power Dissipation
D
5-2) is a function of the maximum ambient
= Worst-case actual power dissipation
= Maximum voltage on V
= Minimum regulator output voltage
= Maximum output (load) current
P
P
Jmax
D
Amax
JA
Dmax

). The 5-Pin SOT-23 package has a
(V
) and the thermal resistance from
), the maximum allowable die
allowable
INmax
=

--------------------------------------- -
T
– V
Jmax
OUTmin

–
JA
T
power
Amax
)I
LOADmax
IN

dissipation
Equation 5-1
Equation 5-2
within limits. For example:
Actual power dissipation:
Maximum allowable power dissipation:
In this example, the TC1070 dissipates a maximum of
26.2 mW which is below the allowable limit of 318 mW.
In a similar manner,
be used to calculate maximum current and/or input
voltage limits.
5.3
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower 
increase the maximum allowable power dissipation
limit.
Given:
Find:
P
I
LOADmax
V
D
V
OUTmin
Layout Considerations
T
T
INmax
 (V
= [(3.0 x 1.10) – (2.7 x .0.98)]40 x 10
= 26.2 mW
Amax
Jmax
1. Actual power dissipation
2. Maximum allowable dissipation
to ensure regulator thermal operation is
P
can be used in conjunction with
INmax
Dmax
= 3.0V ±10%
= 2.7V – 2%
= 40 mA
= +125°C
= +55°C
Equation 5-1
– V
=
= 318 mW
=
 2010 Microchip Technology Inc.

--------------------------------------- -

-------------------------
OUTmin
T
125 55
Jmax
220
–

–
)I
JA
LOADmax
T
and

Amax
Equation 5-2
JA

and therefore
–3
can