KHX12800D3/2G KINGSTON TECHNOLOGY, KHX12800D3/2G Datasheet

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KHX12800D3/2G

Manufacturer Part Number
KHX12800D3/2G
Description
Manufacturer
KINGSTON TECHNOLOGY
Datasheet

Specifications of KHX12800D3/2G

Main Category
DRAM Module
Sub-category
DDR3 SDRAM
Module Type
240DIMM
Device Core Size
64b
Organization
256Mx64
Total Density
2GByte
Chip Density
1Gb
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Number Of Elements
16
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Supplier Unconfirmed
Document No. 4804939-001.A00
DESCRIPTION:
This document describes Kingston's 256M x 64-bit 2GB (2048MB) DDR3-1600 CL9 SDRAM (Synchronous DRAM)
memory module, based on sixteen 128M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3-
1600MHz at a low latency timing of 9-9-9-27 at 1.7V to 1.9V. The SPD is programmed to JEDEC standard latency
DDR3-1066Mhz timing of 7-7-7-20 at 1.5V. This 240-pin DIMM uses gold contact fingers and requires +1.5V. The
JEDEC standard electrical and mechanical specifications are as follows:
FEATURES:
PERFORMANCE:
JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
533MHz fCK for 1066Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 6,7,8,9,10
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7(DDR3-1066)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
Asynchronous Reset
1066Mbps CL7 doesn’t have backward compatibility with 800Mbps CL5
PCB : Height 1.180” (30.00mm), double sided component
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh Command Time (tRFCmin)
Row Active Time (tRASmin)
Power
UL Rating
Operating Temperature
Storage Temperature
T E C H N O L O G Y
2GB 256M x 64-Bit PC3-12800
KHX12800D3/2G
CL9 240-Pin DIMM
K E
Y E
D
04/22/08
7 cycles
50.625ns (min.)
110ns
37.5ns (min.)
TBD W (operating)
94 V - 0
0
-55
o
C to 85
o
C to +100
o
C
o
C
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KHX12800D3/2G Summary of contents

Page 1

... PCB : Height 1.180” (30.00mm), double sided component PERFORMANCE: CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh Command Time (tRFCmin) Row Active Time (tRASmin) Power UL Rating Operating Temperature Storage Temperature Document No. 4804939-001.A00 KHX12800D3/2G CL9 240-Pin DIMM 7 cycles 50.625ns (min.) 110ns 37.5ns (min.) TBD W (operating ...

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... MODULE DIMENSIONS Units: millimeters Document No. 4804939-001.A00 ValueRAM Page 2 ...

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