5962-8866207UA QP SEMICONDUCTOR, 5962-8866207UA Datasheet - Page 14

• Manufacturer Part Number: 5962-8866207UA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8866207UA

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
(original equipment), design applications, and logistics purposes.
prepared specification or drawing.
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone [phone].
[phone].
103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-
VA.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
4.3.1 Group A inspection.
4.3.2 Groups C and D inspections.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (C
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
c. Subgroups 7 and 8 tests sufficient to verify the truth table.
(2) T
which may affect capacitance. Sample size is fifteen devices with no failures and all input and output terminals tested.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
(2) T
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
tests prior to burn-in are optional at the discretion of the manufacturer.
DEFENSE SUPPLY CENTER COLUMBUS
control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-
STD-883.
A
A
MICROCIRCUIT DRAWING
= +125°C, minimum.
COLUMBUS, OHIO 43218-3990
= +125°C, minimum.
IN
STANDARD
and C
OUT
measurement) shall be measured only for the initial test and after process or design changes
SIZE
A
REVISION LEVEL
D
SHEET
5962-88662
14