ISD4004-10MEYD Nuvoton Technology Corporation of America, ISD4004-10MEYD Datasheet - Page 34

• Manufacturer Part Number: ISD4004-10MEYD
• Manufacturer: Nuvoton Technology Corporation of America

Specifications of ISD4004-10MEYD

• Lead Free Status / RoHS Status: Compliant

ISD4004 Series
Notes:
12.5. D
o
o
o
[1]
[2]
[3]
Die Dimensions (with scribe line)
Die Thickness
Pad Opening
The backside of die is internally connected to V
damage may occur.
Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
Double bond is recommended if treated as one pad.
X: 166.6 ± 1 mils
Y: 385.0 ± 1 mils
11.5 ± 0.5 mils
Single pad: 90 x 90 microns
Double pad: 180 x 90 microns
IE
I
NFORMATION
[2]
[1]
- 34 -
SS
V
SSD
≈
V
. It MUST NOT be connected to any other potential or
SSA
V
SSD
[3]
V
SSA
[3]
V
MISO
SSA
MOSI
AUD OUT
ISD4004
SS
SCLK
ISD4004 SERIES
AM CAP
V
CCD
V
CCD
ANA IN-
XCLK
ANA IN+
INT
V
CCA
≈
RAC
[3]
V
CCA
V
SSA
[3]