FDC37C669-MS Standard Microsystems (SMSC), FDC37C669-MS Datasheet - Page 138

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FDC37C669-MS

Manufacturer Part Number
FDC37C669-MS
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of FDC37C669-MS

Pin Count
100
Lead Free Status / RoHS Status
Compliant

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Manufacturer:
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Note 1: All output leakages are measured with the current pins in high impedance as defined by the PWRGD pin.
Note 2: Output leakage is measured with the low driving output off, either for a high level output or a high impedance
Note 3: Defined by the device configuration with the PWRGD input low and 14 MHz clock inactive.
Note 4: Max standby supply current given is for Rev. H and K parts. Contact SMSC for Rev. J and all other Revs.
CAPACITANCE T
OD24 Type Buffer
Low Output Level
Output Leakage
OD24P Type Buffer
Low Output Level
High Output Level
Output Leakage
OP24 Type Buffer
Low Output Level
High Output level
Output Leakage
Supply Current Active
Supply Current Standby
ChiProtect
(SLCT, PE, BUSY, nACK,
nERROR)
Clock Input Capacitance
Input Capacitance
Output Capacitance
PARAMETER
PARAMETER
state defined by PWRGD.
A
= 25°C; fc = 1MHz; V
SYMBOL
SYMBOL
C
I
C
V
V
C
V
V
V
CSBY
I
I
I
I
OUT
I
OL
OL
OL
CC
IN
IN
OL
OL
OH
OL
OH
IL
CC
= 5V
MIN
-10
-10
-10
2.4
2.4
MIN
LIMITS
TYP
TYP
25
138
MAX
MAX
+10
+10
+10
100
±10
0.5
0.5
0.5
35
20
10
20
UNITS
mA
µA
µA
µA
µA
µA
V
V
V
V
V
UNIT
pF
pF
pF
I
V
I
I
V
I
I
V
(Note 1)
All outputs open.
Note 3, 4
Chip in circuit:
V
V
OL
OL
OH
OL
OH
IN
IN
IN
CC
IN
= 24 mA
= 24mA
= 24 mA
= 0 to V
=-30
= 0 to V
=-4mA
= 0 to V
= 6V Max.
= 0V
All pins except pin
under test tied to AC
ground
TEST CONDITION
COMMENTS
μ
A
CC
CC
CC
(Note 1)
(Note 1)

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