LX1973BIPR MICROSEMI, LX1973BIPR Datasheet - Page 8

• Manufacturer Part Number: LX1973BIPR
• Manufacturer: MICROSEMI

Specifications of LX1973BIPR

• Lead Free Status / RoHS Status: Compliant

Copyright © 2007
Rev. 1.3, 2008-01-11
TM
Light Footprint
Recommended
Recommended light footprint pattern
Recommended
light foot print
Recommended light footprint pattern
light foot print
L C
L C
P2
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
P2
Dome Top Package
Dome Bottom Package
PRODUCTION DATA – Information contained in this document is proprietary to
Microsemi and is current as of publication date. This document may not be modified in
any way without the express written consent of Microsemi. Product processing does not
necessarily include testing of all parameters. Microsemi reserves the right to change the
configuration and performance of the product and to discontinue product at any time.
P A C K A G E D I M E N S I O N S ( C O N T I N U E D )
P3
Recommended
PCB Cutout
Active Area
Required Minimum Light footprint
Bonding / Wafer area
Active Area
Required Minimum Light footpri
Bonding / Wafer area
Analog Mixed Signal Group
P1
Minimum light
foot print
®
P1
Minimum light
foot print
Microsemi
Note:
P2 represents a possible light footprint and its
dimensions are not subject to strict tolerances.
Only P1 is required to be covered with light. This
larger footprint is designed to ensure coverage of
the device’s active area.
Automotive Light Sensor
Note:
P2 represents a possible light footprint and its
P3 represents the minimum aperture through which
dimensions are not subject to strict tolerances. Only
P1 is required to be covered with light. This larger
footprint is designed to ensure coverage of the
device’s active area.
the dome of the device would fit in the PCB.
P
Dim
RODUCTION
Dim
P1
P2
P3
P1
P2
M
M
ILLIMETERS
ILLIMETERS
D
1.8
2.5
2.9
1.8
2.5
ATA
S
HEET
I
I
NCHES
0.070
0.098
NCHES
0.070
0.098
0.114
LX1973B
Page 8