5-104074-8 TE Connectivity, 5-104074-8 Datasheet - Page 19

Conn Shrouded Header HDR 6 POS 1.27mm Solder RA Thru-Hole Tube

5-104074-8

Manufacturer Part Number
5-104074-8
Description
Conn Shrouded Header HDR 6 POS 1.27mm Solder RA Thru-Hole Tube
Manufacturer
TE Connectivity
Type
Shrouded Headerr
Series
AMPMODU System 50r
Datasheet

Specifications of 5-104074-8

Pitch
1.27 mm
Number Of Rows
1
Number Of Contacts
6
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Pitch (mm)
1.27mm
Number Of Contact Rows
1
Mounting Style
Through Hole
Body Orientation
Right Angle
Operating Temp Range
-65C to 105C
Voltage Rating Max
30VAC
Contact Material
Copper Alloy
Housing Material
Thermoplastic
Housing Color
Black
Product Height (mm)
6.35mm
Product Length (mm)
13.97mm
Product Depth (mm)
11.17mm
Connector Type
Wire To Board
Contact Termination
Right Angle Through Hole
No. Of Contacts
6
No. Of Rows
1
Pitch Spacing
0.05"
Rohs Compliant
Yes
Product Type
Headers
Mounting Angle
Right
Number Of Positions / Contacts
6
Voltage Rating
30 VAC
Shrouded
Yes
Mount Angle
Right Angle
Pcb Mount Style
Through Hole
Pcb Mount Retention
With
Voltage (vac)
30
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
500
Termination Post Length (mm [in])
2.54 [0.100]
Solder Tail Contact Plating
Tin over Nickel
Number Of Positions
6
Pcb Mount Retention Type
Hold Down Post(s)
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Connector Style
Plug
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Approved Standards
UL E28476, CSA LR7189
Temperature Range (°c)
-65 – +105
Packaging Method
Tube
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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