NUF8402MNT4G ON Semiconductor, NUF8402MNT4G Datasheet - Page 6

IC FILTER 8CH EMI ESD PROT 16DFN

NUF8402MNT4G

Manufacturer Part Number
NUF8402MNT4G
Description
IC FILTER 8CH EMI ESD PROT 16DFN
Manufacturer
ON Semiconductor
Datasheet

Specifications of NUF8402MNT4G

Resistance (ohms)
100
Capacitance
17pF
Package / Case
16-TDFN Exposed Pad
Resistance In Ohms
100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Tolerance
-
Other names
NUF8402MNT4G
NUF8402MNT4GOSTR

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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Email: orderlit@onsemi.com
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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16X
REFERENCE
2X
16X
2X
PIN ONE
0.10 C
0.08 C
0.15 C
L
16X
0.15 C
K
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
1
16
BOTTOM VIEW
SIDE VIEW
TOP VIEW
e
D2
D
NOTE 3
16X
b
8
9
A1
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
E2
A
(A3)
0.10
0.05
B
E
2X
0.25 x 0.40 mm
TEST PAD SIZE
http://onsemi.com
CASE 506AC−01
A
C
C
(A3)
0.50
ISSUE B
C
A
DFN16
*For additional information on our Pb−Free strategy and soldering
SEATING
PLANE
B
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
6
16X
0.28
SOLDERING FOOTPRINT*
14X
NOTES:
0.50 PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO TERMINAL AND
4. COPLANARITY APPLIES TO THE EXPOSED
ANSI Y14.5M, 1982.
IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
D
K
b
E
e
L
4.10
MILLIMETERS
MIN
0.80
0.00
0.18
3.10
0.30
0.20
0.20
0.20 REF
4.00 BSC
1.60 BSC
0.50 BSC
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.00
0.05
0.30
3.30
0.50
0.40
−−−
16X
0.51
SCALE 16:1
NUF8402MN/D
1.91
inches
mm

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