NUF3101FCT1G ON Semiconductor, NUF3101FCT1G Datasheet
NUF3101FCT1G
Specifications of NUF3101FCT1G
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NUF3101FCT1G Summary of contents
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... T T −40 to +85 ° −55 to +150 °C STG T +125 °C J NUF3101FCT1 NUF3101FCT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com C2 100 100 R B2 GND MARKING ...
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ELECTRICAL CHARACTERISTICS Characteristic Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Series Resistance Series Resistance Series Resistance Capacitance Cut−Off Frequency 0 −5 −10 −15 −20 −25 −30 −35 1.0E+07 45 B3− ...
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PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width − 280 − 270 − 260 − 250 − 240 ...
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... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. ...