QSE-028-01-L-D-DP-A Samtec Inc, QSE-028-01-L-D-DP-A Datasheet
QSE-028-01-L-D-DP-A
Manufacturer Part Number
QSE-028-01-L-D-DP-A
Description
.8mm DOUBLE ROW MI SOCKET ASSEMBLY
Manufacturer
Samtec Inc
Datasheet
1.QSE-028-01-L-D-DP-A.pdf
(1 pages)
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For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QSE-DP
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 2A @ 80°C
Ground Plane: 9.5A @ 80°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (014-042)
(0,15mm) .006" max (056)
Board Stacking:
For applications requiring
more than two connectors
per board or 56 pairs or higher,
contact ipg@samtec.com
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
0,80
F-208-1
SPECIFIC OPTION
• 8mm, 11mm, 14mm,
• 30µ" (0,76µm) Gold
• Guide Posts & Edge Mount
• 70 Pairs
• “Partitionable”-combine
Call Samtec.
SPECIFICATIONS
15mm, 16mm, 19mm,
22mm, 25mm and 30mm
stack height (Caution:
Some automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifi cations.)
(Specify -H plating for Data
Rate cable mating
applications.)
differential & single-ended
banks in same connector
APPLICATION
mm
Mates with:
QTE-DP, EQDP
(See Application
Specifi c note)
DIFFERENTIAL PAIR
(7,24)
QSE
.285
(3,05)
.120
LEAD STYLE
Processing conditions will affect
mated height.
STACK HEIGHT
QTE-DP
–01
02
01
–014, –028,
(14 pairs per bank)
–042, –056
(20,00) .7875
x (20,00) .7875 + (1,27) .050
HEIGHT WITH
(0,80)
.0315
(5,00) .198
QTE-DP
®
(No. of Pairs/14)
NO. OF
PAIRS
WWW.SAMTEC.COM
Blade &
Beam Design
QSE–014–01–F–D–DP–A
QSE–042–01–L–D–DP–A
ALSO AVAILABLE
(2,40)
.0945
Board Spacing Standoffs.
®
= Gold Flash on Signal Pins and Ground Plane, Matte Tin on
See SO Series.
01
(0,15)
Au over 50µ" (1,27µm) Ni on Ground Plane in contact area,
.006
= 10µ" (0,25µm) Gold on Signal Pins and Ground Plane,
Matte Tin over 50µ" (1,27µm) min Ni on all solder tails
Ni on Signal Pins in contact area, 10µ" (0,25µm) min
(0,80mm)
.0315"
pitch
50µ" (1,27µm) min Au over 150µ" (3,81µm)
(3,25)
(7,49)
.128
.295
PLATING
OPTION
= Electro-Polished Selective
(3,81)
.150
Matte Tin on tails
(0,89)
.035
DIA
–RT1
5mm Stack Height
Performance data for other stack heights
available at www.samtec.com?QSE-DP
Differential Pair Signaling
–01
–C*
–L
–F
tails
Integral metal plane for
power or ground
(0,76)
.030
(3,76)
D
.148
DIA
DP
QSE–028–01–F–D–DP–A–RT1
Rated @ -3dB Insertion Loss
QSE-DP
SERIES
8.5 GHz / 17 Gbps
A
OPTION
= Retention
= (8,25mm)
OTHER
Packaging
maximum)
maximum)
Polyimide
Place Pad
.325" DIA
positions
positions
–RT1
–TR
& Reel
Option
Pick &
= Tape
(–042
(–042
–K
fi lm
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