LCMXO2280C-4BN256C Lattice, LCMXO2280C-4BN256C Datasheet - Page 81
LCMXO2280C-4BN256C
Manufacturer Part Number
LCMXO2280C-4BN256C
Description
IC PLD 2280LUTS 211I/O 256CABGA
Manufacturer
Lattice
Datasheet
1.LCMXO1200C-3FTN256I.pdf
(96 pages)
Specifications of LCMXO2280C-4BN256C
Programmable Type
*
Number Of Macrocells
*
Voltage - Input
*
Speed
*
Mounting Type
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
220-1068
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LCMXO2280C-4BN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following:
•
• TN1090 -
• Power Calculator tool included with the Lattice ispLEVER design tool, or as a standalone download from
Thermal Management
www.latticesemi.com/software
Power Estimation and Management for MachXO Devices
document
Thermal Management
4-36
document to find the device/package
MachXO Family Data Sheet
Pinout Information
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