MC100LVEP210FAG ON Semiconductor, MC100LVEP210FAG Datasheet - Page 6

• Manufacturer Part Number: MC100LVEP210FAG
• Description: IC CLOCK DRIVER DUAL DIFF 32LQFP
• Manufacturer: ON Semiconductor
• Series: 100LVEPr
• Type: Fanout Buffer (Distribution)r

Specifications of MC100LVEP210FAG

• Number Of Circuits: 2
• Ratio - Input:output: 1:5
• Differential - Input:output: Yes/Yes
• Input: ECL, HSTL, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 3GHz
• Number Of Outputs: 20
• Max Input Freq: 3000 MHz (Typ)
• Propagation Delay (max): 0.43 ns @ 2.375V to 3.8V
• Supply Voltage (max): - 3.8 V or 3.8 V
• Supply Voltage (min): - 2.375 V or 2.375 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Clock Ic Type: Clock Driver
• Supply Current: 70mA
• Supply Voltage Range: 2.375V To 3.8V
• Digital Ic Case Style: LQFP
• No. Of Pins: 28
• Operating Temperature Range: -40°C To +85°C
• Fall Time Tf: 190ps
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC100LVEP210FAGOS

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
13. Measured with 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
14. Skew is measured between outputs under identical transitions of similar paths through a device.
15. Device-to-Device skew for identical transitions at identical V
Table 8. AC CHARACTERISTICS
f
HSTL
t
t
t
t
V
t
Symbol
maxPECL/
PLH
PHL
skew
JITTER
r
/t
PP
f
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Frequency (Figure 4)
Propagation Delay
Propagation Delay @ 2.5 V
Within-Device Skew (Note 14)
Device-to-Device Skew (Note 15)
CLOCK Random Jitter (RMS)
@ v0.5 GHz
@ v1.0 GHz
@ v1.5 GHz
@ v2.0 GHz
@ v2.5 GHz
@ v3.0 GHz
Minimum Input Swing
Output Rise/Fall Time (20%-80%)
Characteristic
800
700
600
500
400
300
200
100
0
0
V
CC
1000
= 0 V; V
EE
2000
Figure 4. F
= -2.375 to -3.8 V or V
MC100LVEP210
http://onsemi.com
FREQUENCY (MHz)
Min
220
150
100
CC
3000
levels.
-40 °C
6
0.184
0.190
0.178
0.196
0.239
0.336
max
Typ
300
800
170
20
85
3
Typical
1200
Max
380
160
250
0.3
0.3
0.3
0.3
0.4
0.5
25
4000
CC
= 2.375 to 3.8 V; V
Min
270
150
120
CC
5000
0.207
0.200
0.197
0.233
0.301
0.422
25°C
Typ
350
800
190
- 2.0 V.
20
85
3
1200
EE
Max
430
160
270
0.3
0.3
0.3
0.4
0.4
0.5
25
6000
= 0 V (Note 13)
Min
300
330
150
150
0.271
0.252
0.259
0.308
0.399
0.572
85°C
Typ
500
410
800
280
20
85
3
1200
Max
750
490
160
350
0.4
0.4
0.4
0.5
0.5
0.9
35
GHz
Unit
mV
ps
ps
ps
ps