NBXSBA007LN1TAG ON Semiconductor, NBXSBA007LN1TAG Datasheet
NBXSBA007LN1TAG
Specifications of NBXSBA007LN1TAG
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NBXSBA007LN1TAG Summary of contents
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... CASE 848AB NBXSBA007 = NBXSBA007 (±50 PPM) 240 ORDERING INFORMATION Device NBXSBA007LN1TAG CLCC−6 NBXSBA007LNHTAG CLCC−6 CLK CLK 5 4 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 3 ...
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Table 1. PIN DESCRIPTION Pin No. Symbol I/O Á Á Á Á Á Á Á Á Á Á Á Á Á Á LVTTL/LVCMOS Control Input Á Á Á Á Á Á Á Á Á Á Á Á Á ...
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Table 5. DC CHARACTERISTICS (V Symbol Characteristic I Power Supply Current Input HIGH Voltage Input LOW Voltage IL I Input HIGH Current IH I Input LOW Current IL V Output HIGH Voltage OH V ...
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Table 7. RELIABILITY COMPLIANCE Parameter Á Á Á Á Á Á Á Á Á Á Á Shock Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Á Solderability ...
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NBXSBA007 Driver Device Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) temp. 260°C 20 − 40 ...
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... L 6X 2.54 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...