322-HCS5P3-300LF TE Connectivity, 322-HCS5P3-300LF Datasheet

322-HCS5P3-300LF

Manufacturer Part Number

322-HCS5P3-300LF

Description

322-HCS5P3-300LF=REELED LF HOL

Manufacturer

TE Connectivity

Datasheet

1.322-HCS8P2-100.pdf (5 pages)

Specifications of 322-HCS5P3-300LF

Socket Style

Standard

Profile

Zero

Frame Style

Film Carrier

Leg Style

Straight

Proprietary Name

HOLTITE

Sleeve Finish

Tin

Contact Resistance (m?)

Contact Rating

Termination Post Length (mm [in])

3.18 [0.125]

Height Above Pc Board (mm [in])

0.00 [0.000]

Centerline (mm [in])

2.54 [0.100]

Row-to-row Spacing (mm [in])

7.62 [0.300]

Number Of Positions

Mount Style

Vertical

Contact Termination Type

Through Hole

Contact Base Material

Beryllium Copper

Contact Plating, Mating Area, Material

Tin

Contact Style

Screw Machine

Mating Contact Type

Four-Fingered

Number Of Patterns Per Reel

Carrier Strip Material

Mylar

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Not relevant for lead free process

Rohs/elv Compliance History

Always was RoHS compliant

Temperature Range (°c)

-55 – +105

Packaging Method

Reel

Packaging Quantity

5,000

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a TE Connectivity Ltd. Company

TE logo is a trademark.

SCOPE

Content

This specification covers performance, tests and quality requirements for the TE Connectivity (TE)

AUGAT* HOLTITE* Sockets. These sockets are designed to be press-fit into a plated through hole of a

printed circuit board. This unique design allows the plated through hole to become a component socket.

The sockets are designed to accept a .016 to .021 inch round lead (5P), .011 X .018 inch rectangular

lead (5P), .020 to .030 inch round lead (6P), .025 to .035 inch round lead (8P) and .035 to .045 inch

round lead (12P).

Qualification

When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.

All inspections shall be performed using the applicable inspection plan and product drawing.

Qualification Test Results

Successful qualification testing on the subject product line has been completed. The Qualification Test

Report number for this testing is 501-500. This documentation is on file at and available from

Engineering Practices and Standards (EPS).

APPLICABLE DOCUMENTS

The following documents form a part of this specification to the extent specified herein. Unless

otherwise specified, the latest edition of the document applies. In the event of conflict between the

requirements of this specification and the product drawing, the product drawing shall take precedence.

In the event of conflict between the requirements of this specification and the referenced documents,

this specification shall take precedence.

TE Documents

Commercial Standard

EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications

REQUIREMENTS

Design and Construction

Product shall be of the design, construction and physical dimensions specified on the applicable product

drawing.

Materials

Materials used in the construction of this product shall be as specified on the applicable product

drawing.

109-197: TE Test Specifications vs EIA and IEC Test Methods

501-500: Qualification Test Report

| Indicates change

*Trademark

Product

Specification

AUGAT* HOLTITE* Sockets

For latest revision, visit our website at www.te.com/documents.

For Regional Customer Service, visit our website at www.te.com

Other products, logos, and company names might be trademarks of their respective owners.

108-1979

11Mar11 Rev B

1 of 5

LOC B

Related parts for 322-HCS5P3-300LF

322-HCS5P3-300LF Summary of contents

Page 1

... Content This specification covers performance, tests and quality requirements for the TE Connectivity (TE) AUGAT* HOLTITE* Sockets. These sockets are designed to be press-fit into a plated through hole of a printed circuit board. This unique design allows the plated through hole to become a component socket. ...

Page 2

Ratings ! Current: 5 amperes using an .062 inch thick glass epoxy, Type FR4, with 2 ounce copper, plated, with electroplated (.001 inch minimum) copper and electroplated tin/lead (.0003 inch minimum) plated through holes. ! Temperature: • Gold contacts: ...

Page 3

Test Description Insertion force. Withdrawal force. Contact retention. Thermal shock. Humidity-temperature cycling. Salt spray. Temperature cycling. Shall meet visual requirements, show no physical damage, and meet requirements of additional NOTE tests as specified in the Product Qualification and Requalification Test ...

Page 4

Product Qualification and Requalification Test Sequence Test or Examination Examination of product Low level contact resistance Insulation resistance Temperature rise vs current Vibration Durability Insertion force Withdrawal force Contact retention Thermal shock Humidity-temperature cycling Salt spray Temperature cycling (a) ...

Page 5

QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Specimen Selection Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. All test groups shall each consist of a minimum of 32 ...

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