LTC2241CUP-12#TRPBF Linear Technology, LTC2241CUP-12#TRPBF Datasheet - Page 27

• Manufacturer Part Number: LTC2241CUP-12#TRPBF
• Description: IC ADC 12BIT 210MSPS 64-QFN
• Manufacturer: Linear Technology

Specifications of LTC2241CUP-12#TRPBF

• Number Of Bits: 12
• Sampling Rate (per Second): 210M
• Data Interface: Parallel
• Number Of Converters: 1
• Power Dissipation (max): 805mW
• Voltage Supply Source: Single Supply
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 64-WFQFN, Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTION
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
9 .00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.25 ±0.05
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 ±0.05
7.15 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.75 ± 0.05
8.10 ±0.05 9.50 ±0.05
UP Package
7.15 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1
6. DRAWING NOT TO SCALE
OUTLINE MO-220 VARIATION WNJR-5
OF PACKAGE DO NOT INCLUDE
SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
LOCATION ON THE TOP AND BOTTOM OF PACKAGE
MOLD FLASH. MOLD FLASH, IF PRESENT,
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
CHAMFER
LTC2241-12
PIN 1
0.50 BSC
0.25 ± 0.05
63
64
(UP64) QFN 1003
27
0.40 ± 0.10
1
2
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