5536254-6 TE Connectivity, 5536254-6 Datasheet

5536254-6

Manufacturer Part Number

5536254-6

Description

140,VT,RC,BD,BD,30AU,125ST

Manufacturer

TE Connectivity

Datasheets

1.1-5536279-0.pdf (8 pages)

2.5536254-4.pdf (1 pages)

Specifications of 5536254-6

Product Type

Connector

Mount Angle

Vertical

Termination Method To Pc Board

Through Hole - Solder

Pcb Mount Retention

Without

Guides

Without

Flame Retardant

Yes

Bus Bar Material

Phosphor Bronze

Tail Length (mm [in])

3.18 [0.125]

Bus Bar Mating Area Plating

Gold (30)

Bus Bar Termination Area Plating

Matte Tin with Nickel underplated

Number Of Positions

140

Signal Contact Material

Phosphor Bronze

Signal Contact Mating Area Plating

Gold (30)

Signal Contact Termination Area Plating

Matte Tin with Nickel underplated

Connector Style

Receptacle

Housing Material

High Temperature Thermoplastic

Stack Height (mm [in])

10.92 [0.430], 18.75 [0.738]

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C

Rohs/elv Compliance History

Always was RoHS compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

5536254-6

Manufacturer:

TE Connectivity AMP Connectors

Quantity:

346

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a TE Connectivity Ltd. Company

TE logo is a trademark.

SCOPE

Content

This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) Micro-

Strip board to board right angle and vertical connector fam ily. These assem blies accom m odate a variety

of printed circuit board thicknesses. Plug assem blies are loaded with .015 inch square m ale Micro-Strip

contacts which m ate with receptacle assem blies loaded with fem ale Micro-Strip contacts.

Qualification

W hen tests are perform ed on subject product line, procedures specified in 109 Series Test

Specifications shall be used. All inspections shall be perform ed using applicable inspection plan and

product drawing.

APPLICABLE DOCUM ENTS

The following docum ents form a part of this specification to the extent specified herein. Unless

otherwise specified, latest edition of the docum ent applies. In the event of conflict between

requirem ents of this specification and product drawing, product drawing shall take precedence. In the

event of conflict between requirem ents of this specification and referenced docum ents, this specification

shall take precedence.

TE Docum ents

REQUIREM ENTS

Design and Construction

Product shall be of design, construction and physical dim ensions specified on applicable product

drawing.

Materials

Ratings

109-1: General Requirem ents for Test Specifications

109 Series: Test Specifications as indicated in Figure 1

114-11005: Application Specification

501-235: Test Report

Contact: Phosphor bronze or beryllium copper, selective gold over nickel plating

Housing: High tem perature therm oplastic, liquid crystal polym er

Voltage: 30 volts alternating current

Current: See Figure 2 for applicable current carrying capability

Tem perature: -65 to 125 C

| Indicates change

*Trademark

Product

Specification

Micro-Strip Board to Board Connector

For latest revision, visit our website at

For Regional Customer Service, visit our website at www.te.com

Other products, logos, and company names might be trademarks of their respective owners.

www.te.com/documents.

108-1272

11Mar11 Rev A

1 of 8

LOC B

Related parts for 5536254-6

5536254-6 Summary of contents

Page 1

... Content This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) Micro- Strip board to board right angle and vertical connector fam ily. These assem blies accom m odate a variety of printed circuit board thicknesses. Plug assem blies are loaded with .015 inch square m ale Micro-Strip contacts which m ate with receptacle assem blies loaded with fem ale Micro-Strip contacts ...

Page 2

Perform ance and Test Description Product is designed to m eet electrical, m echanical and environm ental perform ance requirem ents specified in Figure 1. All tests are perform bient environm ental conditions per Test Specification ...

Page 3

Test Description Mating force. Unm ating force. Durability. Therm al shock. Hum idity-tem perature cycling. Mixed flowing gas. Tem perature life. Shall meet visual requirements, show no physical damage and shall meet requirements of NOTE additional tests as specified in ...

Page 4

Loading Configuration Single (1 bus contact) 40% (2 bus contacts) 100% (5 bus contacts) 50% signal contacts pere, tem perature rise at 100% bus contact To determine acceptable current carrying capacity for percentage connector loading, use NOTE ...

Page 5

Product Qualification and Requalification Test Sequence Exam ination of product Term ination resistance, dry circuit Dielectric withstanding voltage Insulation resistance Tem perature rise vs current Vibration Physical shock Mating force Unm ating force Durability Therm al shock Hum idity-tem ...

Page 6

QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Sam ple Selection Connector housings and contacts shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. Test group 1 shall consist of 5 ...

Page 7

Resistance and Tem perature Measurem ent Points Rev A Figure 4 108-1272 ...

Page 8

Mounting and Clam ping Location for Vibration and Physical Shock Rev A Figure 5 108-1272 ...

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