AD7783BRU-REEL7 Analog Devices Inc, AD7783BRU-REEL7 Datasheet - Page 5

• Manufacturer Part Number: AD7783BRU-REEL7
• Description: IC ADC 24BIT 2CH R-R 16-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD7783BRU-REEL7

• Rohs Status: RoHS non-compliant
• Number Of Bits: 24
• Sampling Rate (per Second): 19.79
• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 3.9mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)

ABSOLUTE MAXIMUM RATINGS*
(T
V
Analog Input Voltage to GND . . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . –0.3 V to V
Total AIN/REFIN Current (Indefinite) . . . . . . . . . . . . . 30 mA
Digital Input Voltage to GND . . . . . . . –0.3 V to V
Digital Output Voltage to GND . . . . . –0.3 V to V
Operating Temperature Range . . . . . . . . . . . –40∞C to +85∞C
Storage Temperature Range . . . . . . . . . . . . –65∞C to +150∞C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150∞C
REV. B
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD7783 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
DD
A
= 25∞C, unless otherwise noted.)
MASTER MODE
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
I = INPUT TO AD7783, AND O = OUTPUT FROM AD7783.
SLAVE MODE IS SELECTED BY TYING THE MODE PIN LOW, WHILE MASTER MODE IS SELECTED BY TYING THE MODE PIN HIGH.
DOUT/RDY (O)
SLAVE MODE
SCLK (O)
SCLK (I)
CS (I)
Model
AD7783BRU
AD7783BRU-REEL
AD7783BRU-REEL7 –40∞C to +85∞C
EVAL-AD7783EB
t
2
t
3
t
10
Figure 2. Slave/Master Mode Timing Diagram
Temperature Range
–40∞C to +85∞C
–40∞C to +85∞C
t
t
4
4
MSB
t
t
5
5
DD
DD
DD
DD
t
t
6
6
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
–5–
LSB
t
9
TSSOP Package
Lead Temperature, Soldering
*Stresses above those listed under Absolute Maximum Ratings may cause per-
Package Description
TSSOP
TSSOP
TSSOP
Evaluation Board
manent damage to the device. This is a stress rating only; functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C
JA
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 97.9∞C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 14∞C/W
MSB
Package Option
RU-16
RU-16
RU-16
LSB
t
8
AD7783
t
7