MCP4342-502E/ST Microchip Technology, MCP4342-502E/ST Datasheet - Page 3

IC DGTL POT QUAD 5K 14TSSOP

MCP4342-502E/ST

Manufacturer Part Number
MCP4342-502E/ST
Description
IC DGTL POT QUAD 5K 14TSSOP
Manufacturer
Microchip Technology
Series
WiperLock™r
Datasheet

Specifications of MCP4342-502E/ST

Package / Case
14-TSSOP
Taps
129
Resistance (ohms)
5K
Number Of Circuits
4
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Non-Volatile
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
5K
Number Of Pots
Quad
Taps Per Pot
129
Resistance
5 KOhms
Wiper Memory
Non Volatile
Buffered Wiper
Buffered
Digital Interface
SPI
Operating Supply Voltage
2.7 V to 5.5 V
Supply Current
450 uA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
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Quantity
Price
Part Number:
MCP4342-502E/ST
Manufacturer:
Microchip
Quantity:
434
1.0
Absolute Maximum Ratings †
Voltage on V
Voltage on CS, SCK, SDI, SDI/SDO, WP, and
RESET with respect to V
Voltage on all other pins (PxA, PxW, PxB, and
SDO) with respect to V
Input clamp current, I
(V
Output clamp current, I
(V
Maximum output current sunk by any Output pin
Maximum output current sourced by any Output pin
Maximum current out of V
Maximum current into V
Maximum current into P
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
Package power dissipation (T
TSSOP-14................................................................1000 mW
TSSOP-20................................................................ 1110 mW
QFN-20 (4x4) ...........................................................2320 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins ................................... ≥ 4 kV (HBM),
Maximum Junction Temperature (T
© 2009 Microchip Technology Inc.
......................................................................................25 mA
......................................................................................25 mA
.......................................................................... ≥ 300V (MM)
.....................................................................-40°C to +125°C
I
O
< 0, V
< 0 or V
I
ELECTRICAL
CHARACTERISTICS
> V
O
DD
DD
> V
with respect to V
, V
DD
I
) ..................................................±20 mA
> V
IK
SS ............................
OK
PP ON
DD
X
SS ...................................
A, P
SS
pin ....................................100 mA
pin .................................100 mA
X
HV pins) ......................±20 mA
W & P
A
SS
= +50°C, T
J
................ -0.6V to +7.0V
) ......................... +150°C
X
B pins ............±2.5 mA
-0.3V to V
-0.6V to 12.5V
J
= +150°C)
DD
+ 0.3V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
MCP434X/436X
DS22233A-page 3

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