MINISMDC150F/12 TE Connectivity, MINISMDC150F/12 Datasheet - Page 14

• Manufacturer Part Number: MINISMDC150F/12
• Description: POLYSWITCH, SMD, 1812, 1.5A
• Manufacturer: TE Connectivity
• Series: MiniSMDCr

Specifications of MINISMDC150F/12

• Tripping Current: 3.00A
• Initial Resistance Max: 0.110ohm
• Operating Voltage: 12V
• Approval Bodies: CSA & TUV
• Approval Category: ELV Compliant, UL Recognised
• External Depth: 0.48mm
• External: RoHS Compliant

13
107
UL
CSA
TÜV
Solder Reflow
Rework
Classification Reflow Profiles
Profile Feature
Average Ramp-Up Rate (Ts
Preheat
• Temperature Min (Ts
• Temperature Max (Ts
• Time (ts
Time maintained above:
• Temperature (T
• Time (t
Peak/Classification Temperature (T
Time within 5 °C of actual Peak
Temperature (t
Ramp-Down Rate
Time 25 °C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Agency Recognition for Surface-mount Devices
Solder Reflow and Rework Recommendation for Surface-mount Devices
Figure S13
• Recommended reflow methods:
• Recommended maximum paste thickness:
• Devices can be cleaned using standard methods and aqueous solvents.
• Raychem circuit protection believes that the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of
• Raychem circuit protection requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces,
• nanoSMD, microSMD and miniSMD series: standard industry practices . Please also avoid direct contact to the device.
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.
solder paste is placed underneath each device's via. As such, Raychem circuit protection requests that customers comply with our
recommended solder pad layouts.
etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices.
• IR
• Hot air
• Nitrogen
• nanoSMD, microSMD and miniSMD series: 0.25mm (0.010 inch)
• SMD series: 0.38mm (0.015 inch)
L
)
min
to ts
p
)
L
max
)
)
min
max
)
)
max
to Tp)
p
)
File # E74889 for all surface-mount devices
File # CA78165 for all surface-mount devices
Certificate # R9872048 for microSMD and miniSMD series
Certificate # R2172061 for nanoSMD series
Certificate # R9872049 for SMD series
Reflow Profile
Sn-Pb Eutectic Assembly
3 °C/second max.
100 °C
150 °C
60-120 seconds
183 °C
60-150 seconds
260 °C
10-30 seconds
6 °C/second max.
6 minutes max.
Pb-Free Assembly
3° C/second max.
150 °C
200 °C
60-180 seconds
217 °C
60-150 seconds
260 °C
20-40 seconds
6 °C/second max.
8 minutes max.