BH2220FVM-TR Rohm Semiconductor, BH2220FVM-TR Datasheet - Page 6

IC CONVERTER D/A 8BIT 3CH MSOP8

BH2220FVM-TR

Manufacturer Part Number
BH2220FVM-TR
Description
IC CONVERTER D/A 8BIT 3CH MSOP8
Manufacturer
Rohm Semiconductor
Series
-r
Datasheets

Specifications of BH2220FVM-TR

Settling Time
100µs
Number Of Bits
8
Data Interface
Serial
Number Of Converters
3
Voltage Supply Source
Single Supply
Operating Temperature
-20°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Power Dissipation (max)
-
Number Of Outputs And Type
3 Voltage, Unipolar
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BH2220FVM-TR
Manufacturer:
NA
Quantity:
20 000
Company:
Part Number:
BH2220FVM-TR
Quantity:
3 000
●Notes for use
●Thermal Derating Curve
© 2009 ROHM Co., Ltd. All rights reserved.
BH2219FVM, BH2220FVM
www.rohm.com
(1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
(2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further
(3) Absolute maximum ratings
(4) GND potential
(5) Thermal design
(6) Terminal shorts and mis-mounting
(7) Operation in a strong magnetic field
(8) Reset circuit
・MSOP8
Board size: 70 x 70 x 1.6mm Material : FR4 glass epoxy board (copper foil area less than 3%)
when using them. When modifying externally attached component constants before use, determine them so that they
have sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only
for static characteristics but also including transient characteristics.
Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral components.
Therefore, please ensure that the specifications are not exceeded.
Ensure that the GND terminal is at the lowest potential under all operating conditions.
Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating conditions.
Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by the
introduction of foreign matter between the output terminals or across the output and power supply or GND may also
result in destruction.
Operation in a strong electromagnetic field may cause malfunction.
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons.
Therefore, set the time constant so as to satisfy the power source rise time.
500
400
300
200
100
0
0
25
50
Fig.18
6/7
Ta [℃]
75
100
125
2009.06 - Rev.A
Technical Note

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