BH2223FV-E2 Rohm Semiconductor, BH2223FV-E2 Datasheet - Page 6

• Manufacturer Part Number: BH2223FV-E2
• Description: IC CONV D/A 8BIT 10CH SSOP-B16
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of BH2223FV-E2

• Data Interface: Serial
• Number Of Bits: 8
• Number Of Converters: 10
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 400mW
• Operating Temperature: -20°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Resolution (bits): 8bit
• Input Channel Type: Serial
• Supply Voltage Range - Analogue: 2.7V To 5.5V
• Supply Current: 1mA
• Digital Ic Case Style: SSOP
• No. Of Pins: 16
• Operating: RoHS Compliant
• Settling Time: -
• Number Of Outputs And Type: 10 Voltage, Unipolar
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Settling Time: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: BH2223FV-E2; BH2223FV-E2-TR

●Notes for use
●Thermal Derating Curve
© 2010 ROHM Co., Ltd. All rights reserved.
BH2223FV,BH2221FV
www.rohm.com
(1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
(2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further
(3) Absolute maximum ratings
(4) GND potential
(5) Thermal design
(6) Terminal shorts and mis-mounting
(7) Operation in a strong magnetic field
(8) Power source voltage
(9) Reset Function
①SSOP-B20(BH2221FV)
②SSOP-B16(BH2223FV)
when using them. When modifying externally attached component constants before use, determine them so that they
have sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only for
static characteristics but also including transient characteristics.
Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral
components. Therefore, please ensure that the specifications are not exceeded.
Ensure that the GND terminal is at the lowest potential under all operating conditions.
Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating
conditions.]
Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by the
introduction of foreign matter between the output terminals or across the output and power supply or GND may also result
in destruction.
Operation in a strong electromagnetic field may cause malfunction.
Set the power source voltage so that VCC ≧ VDD.
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons. Therefore, set
the time constant so as to satisfy the power source rise time.
Mounted on a 70x70x1.6mm FR4 glass epoxy board (copper foil area 3% or below)
700
600
500
400
300
200
100
0
0
25
①
②
50
Ta [℃]
Fig.18
75
6/7
100
125
Technical Note
2010.06 - Rev.B