2008839-1 TE Connectivity, 2008839-1 Datasheet

WIRE-BOARD CONNECTOR RECEPTACLE 1POS 4MM

2008839-1

Manufacturer Part Number

2008839-1

Description

WIRE-BOARD CONNECTOR RECEPTACLE 1POS 4MM

Manufacturer

TE Connectivity

Series

Poke-Inr

Datasheets

1.2008563-1.pdf (5 pages)

2.2008839-1.pdf (2 pages)

Specifications of 2008839-1

Connector Type

Wire To Board

Contact Termination

Right Angle Through Hole

Gender

Receptacle

No. Of Contacts

Pitch Spacing

4mm

Contact Plating

Tin

Rohs Compliant

Yes

Make First / Break Last

Sealed

Termination Method To Pc Board

Through Hole

Pcb Mount Retention

Without

Pcb Mount Alignment

Without

Smt Compatible

Mount Angle

Right Angle

Wire/cable Type

Discrete Wire

Termination Method To Wire/cable

Poke-in

Ul File Number

E28476

Keyed

Contact Current Rating, Max (a)

Operating Voltage (vac)

250

Operating Voltage (vdc)

250

Wire/cable Size (awg)

18 – 22

Tool-less Wire Termination

Yes

Tail Orientation

In-line

Profile Height (y-axis) (mm [in])

3.90 [0.154]

Number Of Positions

Number Of Rows

Length (x-axis) (mm [in])

10.50 [0.413]

Width (z-axis) (mm [in])

3.95 [0.156]

Post-mating Assembly Measurement (mm [in])

10.5 [0.413]

Mating Retention

Without

Header Mating Direction

Horizontal

Preloaded

Yes

Tail Plating Material

Matte Tin over Nickel

Tail Plating, Thickness (µm [?in])

3 [118.11]

Contact Type

Socket

Contact Plating, Mating Area, Material

Matte Tin

Contact Plating, Mating Area, Thickness (µm [?in])

3 [118]

Stamped And Formed

Yes

Connector Style

Receptacle

Mating Alignment

Without

Housing Color

Natural

Ul Flammability Rating

UL 94V-0

Pre-designed Cables Available

Agency/standard

CSA, UL

Agency/standard Number

C22.2 No. 182.3-M1987, UL 1977

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C, Reflow solder capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Circuit Identification Feature

Without

Operating Temperature (°c [°f])

-40 – +105 [-40 – +221]

Applies To

Printed Circuit Board, Wire/Cable

Uv Exposure Rated

Glow Wire Rating

Pcb Thickness, Recommended (mm [in])

1.57 [0.062]

Accepts Wire Insulation Diameter, Range (mm [in])

2.10 [0.0826]

Lighting Interconnect Level

Level 2

Application Use

Wire-to-Board

Packaging Method

SMT Pocket Tape

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1.1.

1.2.

1.3.

2.1.

2.2.

2.3.

3.1.

| Indicates Change

* Trademark TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of their respective owners.

SCOPE

Content

This specification covers performance, tests and quality requirements for the TE Connectivity (TE)

Surface Mount (SMT) and Through-Hole Poke-In Connectors used with 18 to 22 AWG solid copper

wire, 18 to 20 AWG prebond stranded wire, and 18 AWG stranded wire in indoor/outdoor lighting.

Qualification

When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.

All inspections shall be performed using the applicable inspection plan and product drawing.

Qualification Test Results

Successful qualification testing on the subject product line was completed on 02May08. Additional

testing was completed on 17Oct11. The Qualification Test Report number for this testing is 501-679.

This documentation is on file at and available from Engineering Practices and Standards (EPS).

APPLICABLE DOCUMENTS

The following documents form a part of this specification to the extent specified herein. Unless

otherwise specified, the latest edition of the document applies. In the event of conflict between the

requirements of this specification and the product drawing, the product drawing shall take precedence.

In the event of conflict between the requirements of this specification and the referenced documents,

this specification shall take precedence.

TE Documents

Industry Documents

Reference Document

109-197: Test Specification (TE Test Specifications vs EIA and IEC Test Methods)

REQUIREMENTS

Design and Construction

Product shall be of the design, construction and physical dimensions specified on the applicable product

drawing.

109 Series: Test Specifications as indicated in Figure 1

114-13194: Application Specification (Surface Mount Technology (SMT) and Through-Hole Poke-

In Connectors)

501-679: Qualification Test Report (SMT and Through-Hole Poke-In Connector)

EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications

JEDC JESD22-B102: Solderability

Product

Specification

SMT and Through-Hole Poke-In Connector

For latest revision, visit our website at www.te.com/documents.

For Regional Customer Service, visit our website at www.te.com

108-2284

27Oct11 Rev B

1 of 5

LOC B

Related parts for 2008839-1

2008839-1 Summary of contents

Page 1

... Tyco Electronics Corporation Connectivity Ltd. Company All Rights Reserved | Indicates Change * Trademark TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of their respective owners. For latest revision, visit our website at www.te.com/documents. For Regional Customer Service, visit our website at www.te.com ...

Page 2

Materials Materials used in the construction of this product shall be as specified on the applicable product drawing. 3.3. Ratings Voltage: 250 volts AC RMS, 250 volts DC ! Current: 4 amperes maximum ! Temperature: -40 to 105°C ! ...

Page 3

Test Description Mechanical shock. Wire insertion force. Wire retention force. Thermal shock. Humidity/temperature cycling. Temperature life. Shall meet visual requirements, show no physical damage, and meet requirements of additional NOTE tests as specified in the Product Qualification and Requalification Test ...

Page 4

Product Qualification and Requalification Test Sequence Test or Examination Initial examination of product LLCR Withstanding voltage Surface mount solderability Resistance to reflow soldering heat Random vibration Mechanical shock Wire insertion force Wire retention force Thermal shock Humidity/temperature cycling Temperature ...

Page 5

QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Specimen Selection Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. Test groups 1, 2 and 3 shall each consist of 15, ...

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