ISPLSI 2064E-100LT100 Lattice, ISPLSI 2064E-100LT100 Datasheet

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ISPLSI 2064E-100LT100

Manufacturer Part Number
ISPLSI 2064E-100LT100
Description
CPLD ispLSI® 2000E Family 2K Gates 64 Macro Cells 100MHz EECMOS Technology 5V 100-Pin TQFP
Manufacturer
Lattice
Datasheet

Specifications of ISPLSI 2064E-100LT100

Package
100TQFP
Family Name
ispLSI® 2000E
Device System Gates
2000
Maximum Propagation Delay Time
13 ns
Number Of User I/os
64
Number Of Logic Blocks/elements
16
Typical Operating Supply Voltage
5 V
Maximum Operating Frequency
100 MHz
Operating Temperature
0 to 70 °C
• SuperFAST HIGH DENSITY IN-SYSTEM
• HIGH PERFORMANCE E
• ispLSI OFFERS THE FOLLOWING ADDED FEATURES
• OFFERS THE EASE OF USE AND FAST SYSTEM
Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
2064e_06
Features
PROGRAMMABLE LOGIC
— 2000 PLD Gates
— 64 I/O Pins, Four Dedicated Inputs
— 64 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
— Small Logic Block Size for Random Logic
— 100% Functionally and JEDEC Upward Compatible
— TTL Compatible Inputs and Outputs
— 5V Programmable Logic Core
— ispJTAG™ In-System Programmable via IEEE 1149.1
— User-Selectable 3.3V or 5V I/O Supports Mixed
— PCI Compatible Outputs
— Open-Drain Output Option
— Electrically Erasable and Reprogrammable
— Non-Volatile
— Unused Product Term Shutdown Saves Power
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Prototyping
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
— Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Machines, Address Decoders, etc.
with ispLSI 2064 Devices
f
t
(JTAG) Test Access Port
Voltage Systems
Market and Improved Product Quality
Logic and Structured Designs
Minimize Switching Noise
Interconnectivity
max = 200 MHz Maximum Operating Frequency
pd = 4.5 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
The ispLSI 2064E is a High Density Programmable Logic
Device. The device contains 64 Registers, 64 Universal
I/O pins, four Dedicated Input Pins, three Dedicated
Clock Input Pins, two dedicated Global OE input pins and
a Global Routing Pool (GRP). The GRP provides com-
plete interconnectivity between all of these elements.
The ispLSI 2064E features 5V in-system programmabil-
ity and in-system diagnostic capabilities. The ispLSI
2064E offers non-volatile reprogrammability of the logic,
as well as the interconnect to provide truly reconfigurable
systems.
The basic unit of logic on the ispLSI 2064E device is the
Generic Logic Block (GLB). The GLBs are labeled A0, A1
.. B7 (see Figure 1). There are a total of 16 GLBs in the
ispLSI 2064E device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
Functional Block Diagram
Description
A0
A2
A3
A1
A4
GLB
SuperFAST™ High Density PLD
Output Routing Pool (ORP)
ispLSI
B7
B7
A5
Global Routing Pool
Logic
Array
Output Routing Pool (ORP)
Input Bus
In-System Programmable
(GRP)
D Q
D Q
D Q
D Q
B6
B6
Input Bus
A6
B5
B5
A7
®
2064E
B4
B4
January 2002
B3
B0
B2
B1
0139/2064E

Related parts for ISPLSI 2064E-100LT100

ISPLSI 2064E-100LT100 Summary of contents

Page 1

... The basic unit of logic on the ispLSI 2064E device is the Generic Logic Block (GLB). The GLBs are labeled A0 (see Figure 1). There are a total of 16 GLBs in the ispLSI 2064E device. Each GLB is made up of four macrocells ...

Page 2

... Input Bus GLBs. Delays through the GRP have been equalized to minimize timing skew. Clocks in the ispLSI 2064E device are selected using the dedicated clock pins. Three dedicated clock pins (Y0, Y1, Y2 asynchronous clock can be selected on a GLB basis. The asynchronous or Product Term clock can be generated in any GLB for its own clock ...

Page 3

... Input High Voltage IH Capacitance (TA=25°C, f=1.0 MHz) SYMBOL PARAMETER C Dedicated Input Capacitance 1 C I/O Capacitance 2 C Clock Capacitance 3 Erase/Reprogram Specification PARAMETER Erase/Reprogram Cycles Specifications ispLSI 2064E 1 -0.5 to +7.0V +1.0V CC +1.0V CC PARAMETER T = 0°C to +70° 3.3V TYPICAL MINIMUM 10,000 3 MIN. ...

Page 4

... Maximum I varies widely with specific device configuration and operating frequency. Refer to the CC Power Consumption section of this data sheet and the Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum I Specifications ispLSI 2064E Figure 2. Test Load GND to 3.0V 1.5 ns 1.5V 1 ...

Page 5

... Unless noted otherwise, all parameters use a GRP load of four GLBs, 20 PTXOR path, ORP and Y0 clock. 2. Refer to Timing Model in this data sheet for further details. 3. Standard 16-bit counter using GRP feedback. 4. Reference Switching Test Conditions section. Specifications ispLSI 2064E Over Recommended Operating Conditions 1 DESCRIPTION ...

Page 6

... Global Reset to GLB gr 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. Specifications ispLSI 2064E 1 Over Recommended Operating Conditions DESCRIPTION 3 ...

Page 7

... Clock (max) + Reg co + Output grp + ptck(max (#20 + #22 + #35) + (#31) + (#36 + #38) 7.9ns = (0.5 + 0.6 + 4.0) + (0.3) + (0.9 + 1.6) Note: Calculations are based upon timing specifications for the ispLSI 2064E-200L. Specifications ispLSI 2064E GRP GLB Feedback Comb 4 PT Bypass #23 GRP Reg 4 PT Bypass #22 # XOR Delays #25, 26, 27 Control ...

Page 8

... I CC can be estimated for the ispLSI 2064E using the following equation (mA PTs * 0.75 nets * Max freq * 0.004) Where PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max freq = Highest Clock Frequency to the device (in MHz) The I CC estimate is based on typical conditions ( 5.0V, room temperature) and an assumption of two GLB loads on average exists ...

Page 9

... VCCIO 1, 24 10, 26, 50, 61, 89, 99 pins are not to be connected to any active signals, VCC or GND. 2. Pins have dual function capability. Specifications ispLSI 2064E 19, 20, Input/Output Pins - These are the general purpose I/O pins used by the 23, 28, logic array. 31, 32, 35, 36, 42, 43, ...

Page 10

... Pin Configuration ispLSI 2064E 100-Pin TQFP Pinout Diagram VCCIO 1 GND VCC 12 GND 13 BSCAN 14 RESET 15 2 TDI VCCIO 24 GND pins are not to be connected to any active signals, VCC or GND. 2. Pins have dual function capability. Specifications ispLSI 2064E ...

Page 11

... Specifications ispLSI 2064E – XXX X XXXX COMMERCIAL ORDERING NUMBER 4.5 ispLSI 2064E-200LT100 7.5 ispLSI 2064E-135LT100 ispLSI 2064E-100LT100 Grade Blank = Commercial Package T100 = TQFP Power L = Low 0212/2064E PACKAGE 100-Pin TQFP 100-Pin TQFP 100-Pin TQFP Table 2-0041A/2064E ...

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