CL21C101JBANNNC Samsung Electro-Mechanics, CL21C101JBANNNC Datasheet - Page 18

• Manufacturer Part Number: CL21C101JBANNNC
• Description: CAP,100PF,50V,5%,SMD,0805
• Manufacturer: Samsung Electro-Mechanics

● ADHESIVES
▶ Requirements for Adhesives
▶ Application Method
▶ Adhesive hardening Characteristics
● MOUNTING
▶ Mounting Head Pressure
mounting.
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during
or less
To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within 2 minutes
circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly. They should not corrode the circuit board or chip material.
They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be
harmful when touched.
adhesion and overflow into the land, respectively.
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
They must have enough adhesion, so that, the chips will not fall off or move during the handling of the
It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor
PCB
.
Land
c
a
a
Solder Resist
c
b
Type
a
b
c
70~100 ㎛
0.2 min
> 0
21
70~100 ㎛
0.2 min
unit : mm
> 0
31