CL10C332JA8NNNC SAMSUNG, CL10C332JA8NNNC Datasheet - Page 30

• Manufacturer Part Number: CL10C332JA8NNNC
• Description: MLCC 0603 C0G 3300PF 5% 25V
• Manufacturer: SAMSUNG

Multilayer Ceramic Capacitor - General
● Soldering
▶ Soldering Methods
▶ Soldering Profile
▶ Manual Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
* We recommend the reflow soldering method.
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.
300
250
200
150
100
50
℃
soldering
soldering
Method
Reflow
Flow
preheating
60~120sec
Reflow Soldering
soldering
10~20sec
- Overall heating
- Local heating
- Single wave
- Double wave
cooling
Classification
- Infrared rays
- Hot plate
- VPS(vapor phase)
- Air heater
- Laser
- Light beam
300
250
200
150
100
50
℃
preheating
△ T ≤ 150 ℃
60~120sec
-
Flow Soldering
soldering
3~4sec
cooling
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