ERJ3EKF1962V Panasonic, ERJ3EKF1962V Datasheet - Page 5

• Manufacturer Part Number: ERJ3EKF1962V
• Description: RES 19.6K OHM 1/10W 1% 0603 SMD
• Manufacturer: Panasonic

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In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
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1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
3. When using a soldering iron, never let the tip of the soldering iron touch the body of the chip resistor. When
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool ( pliers or tweezers) as it may
Design, Specifications are subject to change without notice.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Recommended Land Pattern
Recommended Soldering Conditions
Recommendations and precautions are described below.
l Recommended soldering conditions for reflow
l Recommended soldering conditions for flow
and confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it
could impair performance and/or reliability of the resistor.
Never exceed the specified rated power.
the resistors.
using a soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three
seconds and up to 350 ¡C).
damage protective coating or the body of the resistor and may affect its performance.
Safety Precautions
áReflow soldering
áPlease contact us for additional information when
áPlease measure temperature of terminations and study
used in conditions other than those specified.
solderability for every kind of solder and board, before
actual use.
Preheating
Soldering
shall be
140 ¡C to 160 ¡C
two
Temperature
245±5 ¡C
times maximum.
For soldering
Ask factory for technical specifications before purchase and/or use.
60 s to 120 s
20 s to 30 s
Time
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
ERJ2R
(0402)
ERJ3R, 3EK
(0603)
ERJ6R, 6EN
(0805)
ERJ8EN
(1206)
ERJ14N
(1210)
ERJ12N
(1812)
ERJ12S
(2010)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
(inches)
Type
Precision Thick Film Chip Resistors
150 ¡C to 180 ¡C
Temperature
max. 260 ¡C
0.5 to 0.6
0.7 to 0.9
3.3 to 3.7
1 to 1.4
2 to 2.4
2 to 2.4
3.6 to 4
140 ¡C to 160 ¡C
150 ¡C to 180 ¡C
Above 200 ¡C
Above 230 ¡C
Temperature
Temperature
max. 260 ¡C
235 ± 5 ¡C
For lead-free soldering
a
Dimensions (mm)
1.4 to 1.6
3.2 to 3.8
5.7 to 6.5
2 to 2.2
4.4 to 5
4.4 to 5
6.2 to 7
b
60 s to 120 s
max. 10 s
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
Time
Time
Time
0.4 to 0.6
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
0.8 to 1
c